TST-108-02-H-D SAMTEC Connector (Other) In Stock
SAMTEC TST-108-02-H-D is a 16-position dual-row shrouded PCB header with 0.100" (2.54 mm) pitch in a 1.1" body length horizontal configuration. Features 30 µin gold over nickel contact plating for high-reliability mating in demanding signal applications. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- TST-108-02-H-D Datasheet PDF
- Category
- Connector
- Price
- From $2.0905(MOQ 1)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TST-108-02-H-D?
- 16-position dual-row shrouded header with 0.100" (2.54 mm) pitch and 1.1" body length for compact 16-pin board interconnects
- 30 µin gold over nickel contact plating provides superior wear resistance for high-cycle applications exceeding 500 mating cycles
- Horizontal (H) mating direction enables flat ribbon cable or harness connections parallel to the PCB surface in space-limited enclosures
What is TST-108-02-H-D used for?
The TST-108-02-H-D is used in industrial control boards, embedded computing platforms, and test and measurement instruments requiring a 16-pin shrouded horizontal ribbon cable interface. Its 30 µin gold plating makes it suitable for applications with frequent reconnections, such as field-calibration ports or removable module connectors. The compact 1.1" body at 0.100" pitch allows it to fit into densely populated PCB areas alongside other through-hole components.
What are the specifications of TST-108-02-H-D?
| Factory Lead Time | 2 Weeks, 6 Days |
| YTEOL | 9.1 |
| Body Breadth | 0.365inch |
| Body Depth | 0.365inch |
| Body Length | 1.1inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL |
| Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | GLASS FILLED POLYESTER |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.54mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZATION NOTCH |
| Terminal Length | 0.165inch |
| Terminal Pitch | 2.54mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 16 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Where can I find the TST-108-02-H-D datasheet?
TST-108-02-H-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TST-108-02-H-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the 30 µin gold plating on the TST-108-02-H-D contacts mean for high-cycle connector applications?
The TST-108-02-H-D uses 30 µin (microinch) gold over a nickel barrier on all 16 mating contacts, which is approximately 3 times thicker than the standard 10 µin gold used on many connectors. This heavier gold deposit maintains low and stable contact resistance below 10 mΩ over more than 500 mating cycles, making the connector well suited for test fixtures, field-calibration ports, and removable module interfaces that see frequent reconnection. The nickel barrier also prevents gold migration into the base metal over the connector's service life.
How does the horizontal mating direction benefit rack-mount or panel-mount equipment using the TST-108-02-H-D?
The H (horizontal) designation on the TST-108-02-H-D means the 16-conductor ribbon cable exits the connector parallel to the PCB surface rather than perpendicular. In rack-mount equipment where PCBs are oriented vertically and cable access is from the front or rear panel, the horizontal mating direction routes cables along the card slot without requiring the cable to bend 90 degrees immediately after the connector. This reduces mechanical stress on the cable at the connector interface and lowers the minimum bend radius requirement for the connected ribbon cable at 0.100" (2.54 mm) pitch.
When is the TST-108-02-H-D a cost-effective alternative to a circular connector for a 16-signal interface?
The TST-108-02-H-D is a cost-effective alternative to circular connectors for 16-signal board-to-cable interfaces when the application does not require environmental sealing (IP ratings) or extremely high pull-out force resistance. Circular connectors in 16-pin configurations typically cost several times more than the rectangular shrouded TST header format and require custom cable assemblies. The TST-108-02-H-D accepts standard 16-conductor IDC ribbon cable on 0.100" (2.54 mm) pitch, which is significantly less expensive and available off-the-shelf from most electronics distributors, reducing total cable assembly cost in production quantities.
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About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $5.2300 | $5.23 |
| 100+ | $4.5600 | $456.00 |
| 500+ | $3.7300 | $1865.00 |
| 1000+ | $3.2181 | $3218.07 |
| 2500+ | $2.6695 | $6673.65 |
| 5000+ | $2.0905 | $10452.40 |
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