TST-108-01-S-D SAMTEC Connector (Other) In Stock
TST-108-01-S-D is a dual-row male board connector from SAMTEC with 16 positions and gold-over-nickel mating contacts (30 µin gold, 50 µin nickel). Designed for high-reliability board-to-board and test socket applications with a 1.1-inch body length. Available from stock through authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- TST-108-01-S-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-row male board connector with 30 µin gold over 50 µin nickel mating contacts for superior corrosion resistance and extended cycle life
- 1-week standard factory lead time and RoHS-compliant construction support fast-turn prototype builds and environmentally compliant designs
- Tin-over-nickel termination finish compatible with standard lead-free wave and reflow soldering processes without flux compatibility concerns
Applications
The TST-108-01-S-D is designed for test and measurement sockets, development boards, and high-reliability board-to-board interconnect applications where gold-plated contacts ensure repeatable low-resistance connections across multiple insertions. Its dual-row male pin arrangement suits backplane and mezzanine board designs in industrial automation, embedded computing, and laboratory instrumentation. The 30 µin gold mating finish maintains reliable electrical contact even in environments with vibration or moderate temperature cycling.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 9.1 |
| Body Breadth | 0.365inch |
| Body Depth | 0.365inch |
| Body Length | 1.1inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | GLASS FILLED POLYESTER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.54mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZATION NOTCH |
| Terminal Length | 0.115inch |
| Terminal Pitch | 2.54mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 16 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact plating does the TST-108-01-S-D provide and why does it matter for test socket applications?
The TST-108-01-S-D uses 30 µin (0.76 µm) gold over 50 µin nickel on mating contacts, a specification that supports 500 or more insertion cycles with minimal increase in contact resistance. This is important in test socket and development board applications where frequent mating cycles would wear through thinner finishes, causing intermittent connections and inaccurate test results.
How does the body size of the TST-108-01-S-D affect PCB layout planning?
The TST-108-01-S-D has a body that measures 1.1 inches (27.9 mm) long by 0.365 inches (9.3 mm) wide, giving designers a clear keep-out reference for routing adjacent signal traces and placing nearby components. Its dual-row configuration puts 16 contacts in a compact area, helping reduce the board footprint compared to single-row equivalents carrying the same pin count.
When should a designer choose the TST-108-01-S-D over a lower-cost single-row alternative?
The TST-108-01-S-D's dual-row layout provides twice the pin density of a single-row connector occupying the same board length, which is valuable when routing 16 or more signals in a space-constrained area. Additionally, the 30 µin gold plating and SAMTEC's 1-week lead time make it the better choice for designs requiring long service life and fast procurement, where a lower-cost tin-plated single-row connector would degrade after fewer than 50 mating cycles.
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