TST-108-01-H-D SAMTEC Connector (Other) In Stock
TST-108-01-H-D is a SAMTEC 16-position dual-row board connector with 30 µin gold over 50 µin nickel mating contacts, gold termination with nickel barrier, and a 1.1 inch body length for high-reliability PCB interconnects. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- TST-108-01-H-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 30 µin gold over 50 µin nickel mating contact finish ensures superior conductivity and long mating-cycle reliability
- Full gold termination with nickel barrier on solder tails provides corrosion resistance and robust solder joint integrity
- 1.1 inch body length accommodates a 16-position dual-row layout for high-density board-to-board interconnects
- YTEOL rating of 9.1 years supports long-lifecycle defense and industrial program qualification requirements
Applications
TST-108-01-H-D is used in high-reliability board-to-board connector applications where 30 µin gold contact plating and full gold termination are required for long service life under repeated mating. It is well suited for aerospace avionics, defense electronics, and industrial test equipment where connector reliability over a 9-year-plus operational period is a program requirement. Its dual-row male contact design also makes it applicable in rack-and-panel and backplane interface designs requiring dense, reliable multi-circuit interconnects.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 2 Weeks, 6 Days |
| YTEOL | 9.1 |
| Body Breadth | 0.365inch |
| Body Depth | 0.365inch |
| Body Length | 1.1inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | GLASS FILLED POLYESTER |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.54mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZATION NOTCH |
| Terminal Length | 0.115inch |
| Terminal Pitch | 2.54mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 16 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact plating does TST-108-01-H-D use on both the mating surface and solder termination, and why does that matter?
TST-108-01-H-D uses 30 µin gold over 50 µin nickel on the mating contacts and full gold with a nickel barrier on the solder termination side. This double-gold specification provides corrosion resistance and stable low contact resistance at both interface points, making TST-108-01-H-D suitable for high-reliability aerospace and defense programs where both connection quality and solder joint longevity must be maintained over thousands of operating hours.
How does the YTEOL rating of TST-108-01-H-D affect long-term program planning for defense electronics?
The YTEOL (Years To End Of Life) rating of 9.1 years for TST-108-01-H-D means SAMTEC plans to support this part for at least 9.1 years, giving defense program managers confidence that the connector will remain available for the full program lifecycle without requiring costly re-design or re-qualification due to obsolescence. This long product life rating is a key differentiator over generic connectors in programs with 5-to-10 year sustainment requirements.
For a high-cycle avionics test rack interface, how does TST-108-01-H-D's 30 µin gold plating compare to 10 µin gold alternatives?
TST-108-01-H-D's 30 µin gold mating contact plating provides approximately 3 times the gold thickness of 10 µin gold alternatives, which directly extends the number of reliable mating cycles before the gold layer wears through to the nickel underplate. In high-cycle avionics test rack applications where connectors are mated and unmated frequently, the 30 µin specification significantly reduces the risk of contact resistance increase due to plating wear.
What is the typical factory lead time for TST-108-01-H-D and how should procurement teams manage supply chain risk for this part?
The factory lead time for TST-108-01-H-D is 2 weeks and 6 days. To manage supply chain risk for programs requiring this high-reliability connector, procurement teams should carry safety stock of at least 4 weeks of projected demand and place replenishment orders before stock drops to the 3-week threshold, ensuring continuous supply without relying solely on SAMTEC's factory lead time.
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