TST-106-03-H-D SAMTEC Connector (Other) In Stock
The TST-106-03-H-D is a 12-position dual-row shrouded PCB header from SAMTEC with 0.100 inch (2.54mm) pitch, featuring 30µin gold-over-nickel square-pin contacts for reliable signal interconnection. The 0.9 x 0.365 inch body provides a robust shrouded housing for board-to-cable or board-to-board mating with protection against pin damage and mis-insertion. Suitable for test, instrumentation, and industrial signal distribution applications requiring durable gold-plated contacts.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Datasheet
- TST-106-03-H-D Datasheet PDF
- Category
- Connector
- Price
- From $1.7000(MOQ 1000)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TST-106-03-H-D?
- 30µin gold-over-nickel contact finish delivers low contact resistance below 20 milliohms and durability for over 500 mating cycles without oxidation or wear-related signal degradation
- 12-position dual-row shrouded housing prevents pin damage and guides cable-mate or board-mate connectors into correct alignment during mating
- Square-pin (SQ PIN-SKT) contact style provides four-point surface contact with socket connectors, improving contact reliability versus round-pin designs at 0.100 inch pitch
- 0.100 inch (2.54mm) pitch is the industry-standard spacing for IDC ribbon cable and discrete-wire mating systems, maximizing cable assembly compatibility
- Compact 0.9 x 0.365 inch body accommodates 12 positions in a footprint suited for dense PCB layouts with multiple signal headers
What is TST-106-03-H-D used for?
The TST-106-03-H-D is used as a signal header on test and measurement boards, embedded system development kits, and industrial I/O modules where 12-pin shrouded mating with gold contacts is required for reliable multi-cycle connectivity. The 30µin gold plating makes it appropriate for laboratory instruments and automated test equipment (ATE) probe boards that undergo hundreds of connector mating cycles per day. It also suits backplane signal distribution and sensor interface boards in industrial automation where a standardized 0.100 inch pitch shrouded header provides consistent mating with off-the-shelf ribbon cable assemblies.
What are the specifications of TST-106-03-H-D?
| YTEOL | 9.1 |
| Body Breadth | 0.365inch |
| Body Depth | 0.365inch |
| Body Length | 0.9inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | GLASS FILLED POLYESTER |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.54mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZATION NOTCH |
| Terminal Length | 0.565inch |
| Terminal Pitch | 2.54mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 12 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Where can I find the TST-106-03-H-D datasheet?
TST-106-03-H-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TST-106-03-H-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does the TST-106-03-H-D use, and how many mating cycles does 30µin gold plating support?
The TST-106-03-H-D uses 30µin (30 microinches) of gold over a nickel barrier layer on the mating contact surfaces. A 30µin gold thickness is the industry benchmark for connectors rated to 500 or more mating cycles, as the gold layer wears at approximately 0.02µin per mating cycle under normal insertion forces of 0.5N to 2N per pin. For ATE sockets or development board headers that are mated and de-mated daily, 500 cycles represents over one year of daily use before gold depletion exposes the nickel barrier, which remains low-resistance for several hundred additional cycles before significant oxidation degrades contact performance.
How does the shrouded housing on the TST-106-03-H-D protect the 12-pin header during cable mating?
The shroud on the TST-106-03-H-D encases the 12 square pins within a 0.9 x 0.365 inch protective housing that guides the mating connector housing onto the pins in correct alignment, preventing individual pin bending that occurs with unshrouded headers when connectors are inserted at an angle. The shroud walls absorb lateral insertion forces of up to 10N per mating that would otherwise bend the fine 0.100 inch pitch square pins. The protective housing also prevents accidental pin contact by probes or tools during board handling, which is especially important on populated PCBs in laboratory environments.
What is the physical size of the TST-106-03-H-D body, and how does it fit into a dense PCB layout?
The TST-106-03-H-D body measures 0.9 inches (22.9mm) long by 0.365 inches (9.3mm) wide by 0.365 inches (9.3mm) deep, enclosing 12 positions across 6 pins per row in the dual-row layout at 0.100 inch (2.54mm) pitch. This footprint is compact enough to place alongside other 2.54mm pitch headers on a standard 0.1 inch grid PCB, and the 22.9mm body length fits within a 25mm PCB edge clearance zone typical in compact embedded boards. The consistent 2.54mm pitch aligns with standard PCB via grids, simplifying routing of 12 signal traces from the header to the board's signal layers.
Which cable assemblies or mating connectors are compatible with the TST-106-03-H-D at 0.100 inch pitch?
The TST-106-03-H-D mates with SAMTEC TST-series 12-position cable-mate housings and with industry-standard IDC ribbon cable connectors at 0.100 inch (2.54mm) pitch, including connectors from 3M, Molex, and TE Connectivity that use the same 2.54mm pitch dual-row socket. Compatible ribbon cable assemblies use 24-conductor 28 AWG flat ribbon cable with IDC insulation-displacement termination at 2.54mm pitch, supporting per-pin current ratings up to 1A for signal applications. The gold-over-nickel square-pin contacts mate with both gold-plated and tin-plated socket contacts, with gold-to-gold mating preferred for minimizing contact resistance below 10 milliohms.
In ATE or development board use, how does the TST-106-03-H-D's square-pin contact style affect signal integrity compared to round-pin designs?
The square-pin (SQ PIN-SKT) contact style on the TST-106-03-H-D creates 4 contact points between the pin corners and the socket walls when mated, compared to 2 contact points for a round pin in a round socket. This multi-point contact geometry maintains lower and more consistent contact resistance, typically below 10 milliohms per pin at 100mA, even as the socket spring wears after hundreds of mating cycles. For high-speed signals above 100 MHz where contact resistance variation degrades signal amplitude, the square-pin multi-point engagement reduces skew and impedance discontinuity compared to worn round-pin contacts in the same 0.100 inch pitch form factor.
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| 2500+ | $2.2500 | $5625.00 |
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