TST-105-02-G-D SAMTEC Connector (Other) In Stock
SAMTEC TST-105-02-G-D is a 10-position dual-row male board connector with 0.100 inch pitch and gold-plated phosphor bronze contacts. Features 10 µin gold over 50 µin nickel mating finish and 0.8 inch body length. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Datasheet
- TST-105-02-G-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 10-position dual-row 0.100 inch pitch male connector with phosphor bronze contacts for superior spring force and durability
- Gold (10 µin) over Nickel (50 µin) mating finish providing low contact resistance and extended cycle life
- Gold (Au) over Nickel (Ni) termination finish ensuring reliable solderability and corrosion resistance
- Compact 0.8 inch body length with 1-week factory lead time for rapid prototyping and production builds
Applications
The TST-105-02-G-D is well-suited for board-to-board signal connections in test-and-measurement instruments, medical devices, and industrial control cards where gold-plated contacts ensure reliable low-resistance connections over thousands of mating cycles. Its 10-position dual-row layout at 0.100 inch pitch provides high pin density in compact PCB areas. The phosphor bronze contact material makes it an excellent choice for applications requiring repeated mating and unmating, such as modular embedded systems and development boards.
Specifications
| Factory Lead Time | 1Week |
| YTEOL | 9.1 |
| Body Breadth | 0.365inch |
| Body Depth | 0.365inch |
| Body Length | 0.8inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | GLASS FILLED POLYESTER |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.54mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZATION NOTCH |
| Terminal Length | 0.165inch |
| Terminal Pitch | 2.54mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 10 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact material and plating does the SAMTEC TST-105-02-G-D use?
The TST-105-02-G-D uses phosphor bronze contacts with 10 µin gold over 50 µin nickel mating finish and gold over nickel termination plating. This combination provides low contact resistance below 20 mΩ, excellent corrosion protection, and a typical mating cycle life exceeding 500 insertions.
How does the TST-105-02-G-D compare to tin-plated alternatives for high-reliability designs?
Unlike tin-plated connectors that are prone to oxidation and fretting corrosion, the TST-105-02-G-D's gold (10 µin) over nickel plating maintains stable contact resistance across temperature ranges from -55°C to +125°C. This makes it preferable for medical, aerospace, and instrumentation designs requiring long-term connection reliability.
What PCB footprint area does the TST-105-02-G-D occupy?
The TST-105-02-G-D has a body length of 0.8 inch, breadth of 0.365 inch, and depth of 0.365 inch. The dual-row 10-position layout at 0.100 inch pitch requires approximately 0.8 × 0.365 inch of PCB real estate, making it compact enough for dense board designs in embedded and test equipment applications.
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