TST-104-01-S-D SAMTEC Connector (Other) In Stock
SAMTEC TST-104-01-S-D is a dual-row through-hole male board connector with rectangular contact pattern and 30 µin gold over nickel mating plating in a 0.7" body length. It provides reliable pin-to-socket board-to-board and board-to-wire connections for industrial and embedded computing applications with a 2-week lead time. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- TST-104-01-S-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-row rectangular male contact array with 30 µin gold over nickel mating plating for reliable multi-cycle connections
- 0.7" body length with 0.365" x 0.365" body cross-section for compact through-hole board interconnect footprint
- Tin over nickel termination finish compatible with wave and hand soldering on through-hole PCBs
- SAMTEC TST series quality providing consistent contact alignment and mechanical stability in board-to-board stacking
Applications
The TST-104-01-S-D is used in through-hole board-to-board and board-to-cable interconnect applications in industrial control systems, embedded computing modules, and test-and-measurement equipment requiring a dual-row rectangular male header. Its 30 µin gold mating contacts ensure low-resistance signal paths in power and signal pin configurations for backplane-style assemblies. The connector also appears in prototype evaluation boards and FPGA development kits where secure through-hole male headers are preferred for hand-assembly and repeated module swapping.
Specifications
| Factory Lead Time | 2 Weeks, 6 Days |
| YTEOL | 9.1 |
| Body Breadth | 0.365inch |
| Body Depth | 0.365inch |
| Body Length | 0.7inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | GLASS FILLED POLYESTER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.54mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZATION NOTCH |
| Terminal Length | 0.115inch |
| Terminal Pitch | 2.54mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 8 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact plating specification of the TST-104-01-S-D, and how does it impact connector performance?
The TST-104-01-S-D uses 30 microinches of gold over nickel on the mating contact surfaces and tin with a nickel barrier on the solder terminations. This gold plating level maintains low contact resistance across hundreds of mating cycles while the nickel undercoat prevents gold migration, making the connector suitable for industrial and embedded computing applications requiring reliable multi-insertion performance.
Which board-to-board assembly scenarios benefit most from the TST-104-01-S-D's through-hole dual-row male design?
The TST-104-01-S-D excels in backplane-style assemblies, vertical card-edge connections, and prototype boards where a through-hole dual-row rectangular male header provides mechanical stability during repeated module insertion. Industrial control racks, embedded computing evaluation platforms, and FPGA daughter-card setups with 8 or more contact positions particularly benefit from the 0.7" body length's structural rigidity under insertion force.
How does the body size of the TST-104-01-S-D affect PCB layout planning for dense connector arrays?
The TST-104-01-S-D body measures 0.7" in length and 0.365" x 0.365" in cross-section, providing a compact through-hole footprint for a dual-row rectangular male connector. Designers can tile multiple TST-104-01-S-D units edge-to-edge with standard 0.1" grid spacing to build wider pin arrays, enabling scalable backplane connector architectures with 8 or more total positions per connector row without specialized tooling.
What is the factory lead time for the TST-104-01-S-D, and how should procurement teams plan orders?
The TST-104-01-S-D carries a factory lead time of approximately 2 weeks and 6 days from SAMTEC. Procurement teams should place orders at least 3 weeks before production start dates to avoid schedule delays. For high-volume builds or custom pin configurations, contacting SAMTEC directly can secure blanket-order pricing with shorter effective lead times across quarterly deliveries.
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