TSM-150-04-LM-DV-P SAMTEC Connector (Other) In Stock
TSM-150-04-LM-DV-P is a 100-position dual-row surface-mount terminal strip from SAMTEC with 0.100 inch (2.54 mm) pitch, rated for reliable board-to-board and wire-to-board interconnection in high-density layouts. It features low-profile mounting and gold-plated contacts for optimal signal integrity. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- TSM-150-04-LM-DV-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-150-04-LM-DV-P?
- 100-position dual-row configuration at 0.100 inch pitch maximizes contact density in a compact SMT footprint
- Gold-plated contacts provide low contact resistance and excellent corrosion resistance for long-term signal reliability
- Surface-mount termination enables automated pick-and-place assembly, reducing manufacturing cost and improving placement accuracy
What is TSM-150-04-LM-DV-P used for?
TSM-150-04-LM-DV-P is well suited for high-density digital backplane connections, FPGA development boards, and test-and-measurement equipment requiring 100 contacts in a compact 0.100 inch pitch layout. Its surface-mount design supports automated assembly in telecommunications and industrial control systems where board real estate is limited. The dual-row format also makes it a practical solution for prototype and production boards needing reliable multi-signal connectivity.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-150-04-LM-DV-P datasheet?
TSM-150-04-LM-DV-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-150-04-LM-DV-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the TSM-150-04-LM-DV-P offer, and what is its contact pitch?
The TSM-150-04-LM-DV-P provides 100 positions arranged in a dual-row configuration on a 0.100 inch (2.54 mm) pitch. This high-density layout accommodates 50 contacts per row, making it suitable for FPGA I/O expansion, backplane signals, and multi-channel sensor interfaces where large pin counts must fit within a limited PCB area.
What mounting style does TSM-150-04-LM-DV-P use, and how does it support automated PCB assembly?
TSM-150-04-LM-DV-P uses surface-mount technology (SMT) termination, enabling automated pick-and-place machine handling during reflow soldering. The SMT pads on 0.100 inch centers align with standard PCB footprint libraries, allowing 100-position placement in a single step. This reduces assembly labor compared to through-hole alternatives and improves positional accuracy in high-volume production runs.
In what industrial or test-equipment scenarios is TSM-150-04-LM-DV-P a preferred interconnect choice?
TSM-150-04-LM-DV-P is commonly used in test-and-measurement instruments, industrial controller backplanes, and embedded computing modules requiring dense 100-pin connectivity at 2.54 mm pitch. Its gold-plated contacts withstand thousands of mating cycles, and the dual-row footprint fits standard 0.100 inch grid PCBs. Engineers also use it in prototype racks where swappable daughter cards must interface reliably with a main logic board.
How does TSM-150-04-LM-DV-P compare to single-row terminal strips for high pin-count designs?
The dual-row design of TSM-150-04-LM-DV-P halves the board length required to route 100 signals compared to a single-row strip at the same 0.100 inch (2.54 mm) pitch. A single-row 100-position strip would span 9.9 inches, while this dual-row part spans approximately 5 inches, saving roughly 50% of edge connector space. This makes it significantly more practical for compact multi-signal interfaces in space-constrained enclosures.
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