TSM-150-03-STL-DV-P-TR SAMTEC Connector (Other) In Stock
TSM-150-03-STL-DV-P-TR is a 100-position dual-row surface-mount terminal strip by SAMTEC with 2.54 mm (0.100") pitch. Key specs: 100 circuits in dual-row SMT configuration, gold-plated contacts, 1A per pin current rating. Suited for high-density board-to-board signal interfaces in computing, telecom, and industrial control applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- TSM-150-03-STL-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-150-03-STL-DV-P-TR?
- 100-position dual-row layout with 2.54 mm pitch for maximum signal density in SMT interconnects
- Gold-plated contacts providing low insertion resistance and long mating-cycle reliability
- Surface-mount termination compatible with automated pick-and-place and reflow assembly
- Tape-and-reel (TR) packaging for seamless integration into high-volume SMT production lines
What is TSM-150-03-STL-DV-P-TR used for?
The SAMTEC TSM-150-03-STL-DV-P-TR is designed for high-density board-to-board signal interconnects in server backplanes, FPGA development boards, and telecom line cards requiring 100 contacts at 2.54 mm pitch. Its SMT dual-row format supports high pin-count daughter card connections where DIP or wire-to-board alternatives would consume excessive board space. The tape-and-reel packaging enables cost-efficient automated assembly in high-volume embedded computing and industrial control production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-150-03-STL-DV-P-TR datasheet?
TSM-150-03-STL-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-150-03-STL-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-150-03-STL-DV-P-TR provide, and how are they arranged?
The TSM-150-03-STL-DV-P-TR provides 100 positions arranged in a dual-row configuration with 50 contacts per row and a 2.54 mm (0.100 inch) row pitch. This layout enables compact high-density signal routing between FPGA boards, backplanes, and daughter cards where 100-pin wire-to-board connectors would be impractical.
What current rating does the TSM-150-03-STL-DV-P-TR support per pin, and how is this used in mixed-signal designs?
Each pin of the TSM-150-03-STL-DV-P-TR is rated at 1A, allowing the 100-position connector to carry both low-current digital signals and moderate power rails simultaneously. Designers commonly assign groups of 4-6 pins to power rails such as 3.3V or 5V, distributing up to 4-6A per rail while the remaining 90+ pins carry high-speed digital bus lines.
How does the STL (short tail) variant affect soldering and board clearance for the TSM-150-03-STL-DV-P-TR?
The STL designation means the SMT tail is shorter than the standard version, reducing the solder joint height to approximately 0.3 mm below the PCB pad level. This shorter tail minimizes the risk of bridging adjacent pads during reflow on fine-pitch PCBs and reduces total connector stack height, which is critical in slim embedded computing enclosures with less than 5 mm of clearance between stacked boards.
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