TSM-150-02-TM-DV-P SAMTEC Connector (Other) In Stock
TSM-150-02-TM-DV-P is a 100-position dual-row 0.100 inch pitch surface mount terminal strip connector from SAMTEC. Features through-mold dual-row design with 50 positions per row and standard 2.54 mm pitch for reliable board-level connectivity. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- TSM-150-02-TM-DV-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-150-02-TM-DV-P?
- 100-position dual-row layout with 50 contacts per row for high-density board connections
- 0.100 inch (2.54 mm) standard pitch compatible with industry-standard PCB layouts
- Surface mount termination style enabling automated assembly and reflow soldering
- Through-mold construction providing mechanical robustness for demanding interconnect applications
What is TSM-150-02-TM-DV-P used for?
The TSM-150-02-TM-DV-P is designed for high-density board-to-board and wire-to-board interconnect applications in industrial electronics, computing platforms, and embedded systems. Its 100-position dual-row configuration supports parallel data buses, backplane connections, and multi-signal interface cards. The surface mount design makes it suitable for automated PCB assembly processes requiring reliable, high pin-count connectivity.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-150-02-TM-DV-P datasheet?
TSM-150-02-TM-DV-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-150-02-TM-DV-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the TSM-150-02-TM-DV-P connector provide?
The TSM-150-02-TM-DV-P is a 100-position connector arranged in 2 rows with 50 contacts per row, using a 0.100 inch (2.54 mm) pitch, making it ideal for high-density board-level signal routing in complex embedded systems.
What is the pin pitch of TSM-150-02-TM-DV-P and which PCB layout standards does it support?
The TSM-150-02-TM-DV-P uses a standard 0.100 inch (2.54 mm) pitch, which is compatible with industry-standard PCB footprint libraries and drill patterns. This ensures interoperability with a wide range of mating connectors and automated pick-and-place assembly equipment.
Is TSM-150-02-TM-DV-P suitable for automated reflow soldering processes?
Yes, the TSM-150-02-TM-DV-P features a surface mount termination style that supports automated reflow soldering. Its through-mold dual-row body with 100 pins and 2.54 mm pitch is compatible with standard SMT assembly processes used in high-volume PCB manufacturing environments.
In which applications is the TSM-150-02-TM-DV-P typically deployed?
The TSM-150-02-TM-DV-P is commonly used in backplane interconnects, industrial controller boards, and embedded computing platforms where 100 pins at 2.54 mm pitch are needed. Its dual-row surface mount design provides high contact density for parallel data buses and multi-signal I/O interfaces.
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