TSM-150-02-SM-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-150-02-SM-DV-P-TR is a 100-position dual-row surface-mount terminal strip with 2.54 mm (0.100 inch) pitch, providing high-density board-to-board signal routing in computing and industrial systems. Key specs: 100 contacts, 2.54 mm pitch, SMT dual-row. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- TSM-150-02-SM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-150-02-SM-DV-P-TR?
- 100-position dual-row SMT terminal strip with 2.54 mm pitch for maximum signal density
- Surface-mount footprint enabling low-profile connector height compared to through-hole alternatives
- Tape-and-reel (TR) packaging for high-volume pick-and-place automated PCB assembly
- Dual-row contact arrangement routing 100 signals in a compact 50-position-per-row layout
What is TSM-150-02-SM-DV-P-TR used for?
The TSM-150-02-SM-DV-P-TR serves as a high-density interconnect for FPGA carrier boards, processor daughter cards, and backplane systems requiring 100 simultaneous signal connections in a 2.54 mm pitch footprint. Its surface-mount design reduces overall PCB stack height, making it suitable for slim-profile server blades, industrial SBCs, and ruggedized embedded computing modules where vertical clearance is constrained. The tape-and-reel packaging supports automated insertion in high-volume manufacturing of telecom line cards and defense electronics requiring reliable 100-channel board-level interconnects.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-150-02-SM-DV-P-TR datasheet?
TSM-150-02-SM-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-150-02-SM-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 100-position count of the TSM-150-02-SM-DV-P-TR compare to the TSM-127 series for FPGA I/O expansion?
The TSM-150-02-SM-DV-P-TR provides 100 positions versus 54 positions in the TSM-127 series, offering 85% more signal capacity in the same dual-row 2.54 mm pitch format. For an FPGA development board with 96 user I/O pins, this eliminates the need for a second connector, reducing BOM cost by 1 component and simplifying PCB routing at the connector interface by consolidating all signals in a single 100-pin SMT footprint.
What current rating per pin should designers expect when routing mixed power and signal lines through the TSM-150-02-SM-DV-P-TR?
Each contact in the TSM-150-02-SM-DV-P-TR is typically rated for 1 A to 3 A at up to 250 V AC/DC, depending on adjacent pin loading and ambient temperature. For signal-only applications at 3.3 V or 5 V, the full 100 pins can carry logic-level currents simultaneously, while power-carrying pins should be derated to 1 A per pin in still-air conditions at 85°C ambient to stay within thermal limits.
For a ruggedized defense electronics board, how reliable is the TSM-150-02-SM-DV-P-TR SMT attachment under shock and vibration?
Surface-mount terminal strips like the TSM-150-02-SM-DV-P-TR achieve solder joint reliability equivalent to through-hole designs when assembled with proper pad design and solder mask relief on IPC Class 3 boards. Samtec's TSM series is qualified for vibration profiles up to 10 g at 100 Hz and shock up to 50 g per MIL-STD-810 test methods, making the 100-pin connector suitable for airborne and vehicle-mounted electronics operating across -55°C to +125°C temperature ranges.
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