TSM-150-02-H-DV-P-TR SAMTEC Connector (Other) In Stock

What are the key features of TSM-150-02-H-DV-P-TR?

• 100-position dual-row layout at 0.100 inch (2.54 mm) pitch provides 50 pins per row on a standard 0.1-inch grid, maximizing signal density for backplane and expansion header designs
• Peg (P) board mounting option adds mechanical pins that anchor the terminal strip to the PCB during 260°C peak reflow soldering, preventing connector shift in automated assembly
• Tape-and-reel (TR) packaging enables automated pick-and-place machine handling for high-volume SMT production with consistent connector orientation across 100-position assemblies

What is TSM-150-02-H-DV-P-TR used for?

The TSM-150-02-H-DV-P-TR is designed for high-density backplane interconnect, FPGA expansion headers, and single-board computer I/O connectors where 100 positions at 0.100 inch pitch are required on standard PCB grid layouts. Its surface mount configuration with peg mounting supports automated SMT reflow assembly in industrial embedded computing modules, data acquisition cards, and PLC rack systems where consistent mechanical alignment across 50 pins per row is critical. The dual-voltage contact configuration enables the same connector to route both logic signals and power rails, reducing component count in mixed-signal board designs.

Compliance & Regulatory

Where can I find the TSM-150-02-H-DV-P-TR datasheet?

Official datasheet from SAMTEC

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