TSM-150-02-F-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-150-02-F-DV-P-TR is a 100-position dual-row 2.54 mm (0.100 inch) pitch surface-mount terminal strip with gold-flash contacts, providing a high-density board-to-wire or board-to-board interconnect solution for signal and power distribution on compact PCBs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- TSM-150-02-F-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-150-02-F-DV-P-TR?
- 100-position dual-row configuration in a 2.54 mm (0.100 inch) pitch delivers high signal density in a standard SMT footprint
- Gold-flash mating contacts provide low contact resistance and corrosion protection for reliable signal integrity over extended service life
- Surface-mount termination (SMT) enables automated pick-and-place assembly and reflow soldering, reducing manufacturing cost versus through-hole alternatives
- Tape-and-reel (TR) packaging supports continuous high-volume SMT production line feeding without manual loading
What is TSM-150-02-F-DV-P-TR used for?
The TSM-150-02-F-DV-P-TR is ideal for backplane interconnects, development board expansion headers, and high-density I/O panels where 100 signals or power/ground pairs must be routed between boards in a standard 0.100-inch grid. Its dual-row SMT form factor is commonly used in FPGA evaluation boards, embedded computing modules, and industrial automation controllers that require robust, high-pin-count board-stacking or ribbon-cable connections within a space-constrained enclosure.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-150-02-F-DV-P-TR datasheet?
TSM-150-02-F-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-150-02-F-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-150-02-F-DV-P-TR have, and what is the row arrangement?
The TSM-150-02-F-DV-P-TR is a 100-position connector arranged in 2 rows of 50 contacts each, with a 2.54 mm (0.100 inch) pitch between adjacent pins in both the row and column directions. This dual-row 50×2 layout is compatible with standard 100-pin IDC ribbon cable connectors and common FPGA or microprocessor I/O headers found in embedded development platforms.
What assembly process is the TSM-150-02-F-DV-P-TR designed for, and what does the TR suffix mean?
The TSM-150-02-F-DV-P-TR is a surface-mount (SMT) terminal strip designed for reflow soldering at standard lead-free profiles peaking at 260°C for 30 seconds. The 'TR' suffix denotes tape-and-reel packaging, meaning the connectors are supplied on a continuous reel for automated pick-and-place machines, enabling efficient high-volume PCB assembly with cycle times consistent with other 0402 to 0805 SMT components on the same board.
In which high-density PCB applications would a designer choose the TSM-150-02-F-DV-P-TR over a 50-position single-row strip?
When a design requires routing 100 signals or combined signal and power lines between boards, the dual-row 100-position TSM-150-02-F-DV-P-TR occupies roughly half the PCB edge length of two separate 50-position single-row connectors. This makes it the preferred choice for FPGA mezzanine boards, processor module carrier cards, and backplane expansion slots where PCB real estate along the board edge is limited to approximately 127 mm (5 inches) for the full 50-per-row connector body.
Is the TSM-150-02-F-DV-P-TR compatible with standard 2.54 mm pitch mating headers and IDC cable assemblies?
Yes, the 2.54 mm (0.100 inch) pitch of the TSM-150-02-F-DV-P-TR is the industry-standard pitch used across most dual-row headers, sockets, and 100-conductor IDC ribbon cable assemblies. Mating connectors such as SAMTEC's SSM or SSW series sockets and standard 100-pin ribbon cable plugs are directly compatible, allowing interoperability with widely available cable assemblies from multiple vendors and reducing custom interconnect design effort.
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