TSM-149-05-S-DV-P-TR SAMTEC Connector (Other) In Stock
TSM-149-05-S-DV-P-TR is a 98-position dual-row surface mount terminal strip from SAMTEC with 2.54 mm (0.100") pitch. It features gold-plated contacts, a nylon housing, and tape-and-reel packaging for automated SMT assembly. This high-density connector suits backplane interconnects, board-to-board interfaces, and embedded computing modules requiring reliable, low-profile termination.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 98
- Lifecycle
- ACTIVE
- Datasheet
- TSM-149-05-S-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-149-05-S-DV-P-TR?
- 98-position dual-row layout provides high-density I/O in a compact 2.54 mm pitch SMT footprint
- Gold-plated contacts ensure low contact resistance and long insertion-cycle reliability
- Tape-and-reel (TR) packaging enables high-volume automated pick-and-place assembly
- Surface mount termination style eliminates through-hole drilling, simplifying PCB fabrication
- Nylon insulator withstands standard SMT reflow temperatures up to 260°C
What is TSM-149-05-S-DV-P-TR used for?
The TSM-149-05-S-DV-P-TR is commonly used in embedded computing boards, backplane interconnect systems, and industrial control modules where a high pin-count, 2.54 mm pitch SMT connection is required. Its dual-row, 98-position configuration suits data acquisition cards, FPGA daughter cards, and memory expansion modules that need reliable high-density board-to-board signal routing. The tape-and-reel packaging makes it ideal for OEM manufacturing lines running automated surface mount assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-149-05-S-DV-P-TR datasheet?
TSM-149-05-S-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-149-05-S-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does TSM-149-05-S-DV-P-TR have, and what is its contact pitch?
The TSM-149-05-S-DV-P-TR has 98 total positions arranged in 2 rows with a 2.54 mm (0.100") center-to-center pitch. This high pin count in a dual-row surface mount configuration makes it suitable for high-density board interconnects requiring up to 98 signal or power contacts in a compact SMT footprint.
Can TSM-149-05-S-DV-P-TR withstand standard reflow soldering profiles for SMT assembly?
Yes, the TSM-149-05-S-DV-P-TR is rated for SMT reflow soldering at peak temperatures up to 260°C, complying with standard IPC/JEDEC J-STD-020 profiles. Its nylon insulator and gold-plated contacts maintain dimensional stability and low contact resistance after multiple reflow cycles, making it reliable for high-volume automated assembly.
What board-to-board or backplane applications is TSM-149-05-S-DV-P-TR designed for?
The TSM-149-05-S-DV-P-TR is designed for board-to-board signal interconnects, backplane expansion slots, FPGA daughter cards, and industrial I/O modules that require 98 contacts at 2.54 mm pitch. The surface mount dual-row terminal strip is also used in embedded computing, data acquisition, and test equipment boards where dense signal routing and reliable SMT attachment are priorities.
Is the TSM-149-05-S-DV-P-TR available in tape-and-reel packaging for automated production?
Yes, the -TR suffix in TSM-149-05-S-DV-P-TR designates tape-and-reel packaging, delivering components in reels of typically 500 or 1000 pieces per reel for automated pick-and-place SMT lines. This packaging format reduces handling time, minimizes ESD risk, and is required for high-volume PCB assembly where throughput exceeds 1000 units per production run.
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