TSM-149-03-SM-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-149-03-SM-DV-P-TR is a 98-position dual-row surface mount terminal strip with 2.54 mm (0.100 inch) pitch. It features a vertical orientation with gold-plated contacts designed for reliable SMT assembly. Available worldwide, this high-density connector suits backplane and board-to-board interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 98
- Lifecycle
- ACTIVE
- Datasheet
- TSM-149-03-SM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-149-03-SM-DV-P-TR?
- 98-position dual-row SMT terminal strip with 2.54 mm pitch for high-density board connections
- Surface mount termination enables automated reflow assembly and space-efficient PCB layouts
- Gold-plated contacts provide low contact resistance and long-term corrosion protection
- Tape-and-reel packaging (TR suffix) for high-volume automated pick-and-place assembly
What is TSM-149-03-SM-DV-P-TR used for?
The TSM-149-03-SM-DV-P-TR is designed for high-density board-to-board and backplane interconnect applications in computing, telecommunications, and industrial control systems. Its 98-position dual-row layout efficiently routes large numbers of signals across PCB interfaces while maintaining a compact 2.54 mm pitch footprint. It is also used in test fixtures and development boards where high pin-count surface-mount connectivity is required.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-149-03-SM-DV-P-TR datasheet?
TSM-149-03-SM-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-149-03-SM-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the TSM-149-03-SM-DV-P-TR achieve reliable solder joints in reflow assembly?
The TSM-149-03-SM-DV-P-TR is designed for surface mount reflow soldering with contacts spaced at 2.54 mm (0.100 inch) pitch in a dual-row configuration providing 98 total positions. Its SMT termination pads are optimized for paste stencil printing and standard lead-free reflow at 260°C peak temperature, ensuring consistent solder joint quality in high-volume production.
For a backplane design requiring 98 signals, how does this SAMTEC terminal strip compare to a pin-header alternative?
Compared to through-hole pin headers, the TSM-149-03-SM-DV-P-TR saves PCB real estate by eliminating drill holes and enabling placement on a single PCB side. The surface mount approach supports wave-free assembly, and the 2.54 mm pitch dual-row layout packs 98 positions into a compact footprint roughly 62 mm long, reducing board area versus equivalent single-row headers.
Can the TSM-149-03-SM-DV-P-TR handle mixed signal and power applications on the same connector?
The TSM-149-03-SM-DV-P-TR supports mixed signal and low-power applications within its 98-position capacity, with each contact typically rated for signal currents up to 1 A depending on mating connector specifications. For power distribution, multiple adjacent pins can be connected in parallel to increase current capacity, while signal pins handle digital and analog lines with standard CMOS or TTL logic voltage levels.
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