TSM-149-03-G-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-149-03-G-DV-P-TR is a 98-position dual-row surface mount terminal strip with 2.54 mm (0.100 inch) pitch, featuring gold-plated contacts, press-fit retention pins, and tape-and-reel packaging for high-volume automated assembly in dense board-to-board interconnect designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 98
- Lifecycle
- ACTIVE
- Datasheet
- TSM-149-03-G-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-149-03-G-DV-P-TR?
- 98-position dual-row SMT terminal strip with 2.54 mm (0.100 in) pitch for high-density board connections
- Gold-plated contact finish for low contact resistance and long-term corrosion resistance
- Press-fit retention pins (P suffix) provide mechanical stability during PCB handling before soldering
- Tape-and-reel (TR) packaging enables high-volume automated pick-and-place PCB assembly
What is TSM-149-03-G-DV-P-TR used for?
The TSM-149-03-G-DV-P-TR is used in high-density PCB interconnect applications including embedded computing modules, industrial backplanes, and test and measurement systems requiring 98 contacts in a dual-row SMT footprint. Its gold-plated contacts and press-fit retention pins make it a reliable choice for daughtercard-to-mainboard interfaces and signal routing in systems that demand stable connections across vibration and thermal cycling environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-149-03-G-DV-P-TR datasheet?
TSM-149-03-G-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-149-03-G-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-149-03-G-DV-P-TR provide, and what row arrangement does it use?
The TSM-149-03-G-DV-P-TR has 98 positions arranged in a dual-row configuration with a 2.54 mm (0.100 inch) pitch. This dual-row layout doubles contact density compared to single-row equivalents, making it efficient for backplane signal routing, embedded processor module interfaces, and any application needing up to 98 signal or power connections in a compact SMT footprint.
What retention mechanism does the TSM-149-03-G-DV-P-TR use to hold the connector in place before soldering?
The TSM-149-03-G-DV-P-TR includes press-fit retention pins (indicated by the P suffix in the part number) that anchor the connector body to the PCB during handling and reflow soldering. These pins prevent the 98-position connector from shifting or tipping on the board before solder joints are formed, which is critical for maintaining accurate 2.54 mm pitch alignment on high pin-count assemblies processed through automated reflow ovens.
For a high-density embedded computing interface requiring 98 contacts, how does the TSM-149-03-G-DV-P-TR compare to mezzanine connectors in terms of board height and assembly approach?
The TSM-149-03-G-DV-P-TR is a surface mount terminal strip with a low-profile body height, unlike elevated mezzanine connectors that add 5 mm to 10 mm of stacking height above the board. Its SMT reflow approach integrates into standard automated assembly without special tooling, while its 2.54 mm pitch and 98 pins match many standard embedded module pinout footprints, offering a simpler and lower-cost alternative to proprietary mezzanine connector systems for applications where board stacking height is not required.
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