TSM-149-03-G-DV-P SAMTEC Connector (Other) In Stock
SAMTEC TSM-149-03-G-DV-P is a 98-position dual-row surface mount terminal strip on a 0.100" pitch with gold-plated contacts for high-reliability PCB interconnection. It supports dual-voltage configurations and is designed for high-density signal and power routing in compact surface-mount assemblies. Available from stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 98
- Lifecycle
- ACTIVE
- Datasheet
- TSM-149-03-G-DV-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-149-03-G-DV-P?
- 98-position dual-row 0.100" pitch layout providing high-density signal and power routing in a single SMT footprint
- Gold-plated contact finish (G suffix) ensuring low contact resistance and reliable mating performance across repeated insertion cycles
- Dual-voltage (DV) configuration enabling 2 independent power or signal rails without requiring additional connectors on the PCB
What is TSM-149-03-G-DV-P used for?
The TSM-149-03-G-DV-P is designed for high-density backplane interconnects, daughtercard interfaces, and instrumentation boards where a large number of signals must be routed in a compact 0.100" pitch SMT footprint. Its 98-position dual-row layout supports mixed signal and power distribution, making it suitable for FPGA evaluation boards, communication equipment, and automated test system motherboards. The gold contact finish ensures stable low-resistance connections in production and field-service environments with frequent mating cycles.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-149-03-G-DV-P datasheet?
TSM-149-03-G-DV-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-149-03-G-DV-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the TSM-149-03-G-DV-P provide on its 0.100" pitch surface mount body?
The TSM-149-03-G-DV-P offers 98 positions arranged in a dual-row configuration on a 0.100" (2.54 mm) pitch, making it compatible with standard 0.100" cable and board-to-board mating systems. This high position count allows designers to consolidate up to 98 signal or power connections in a single SMT connector, reducing PCB real estate compared to using multiple smaller connectors.
What advantage does the gold contact finish provide on TSM-149-03-G-DV-P in test and instrumentation systems?
Gold-plated contacts on the TSM-149-03-G-DV-P deliver contact resistance below 20 milliohms and resist oxidation, which is critical in test and measurement fixtures that undergo hundreds or thousands of mating cycles. Gold plating also maintains stable electrical performance across the full operating temperature range, preventing signal degradation on high-frequency or low-level analog measurement channels.
When does the dual-voltage designation on TSM-149-03-G-DV-P simplify power rail routing on a dense PCB?
The DV (dual-voltage) designation on the TSM-149-03-G-DV-P allows 2 separate voltage potentials, such as 3.3V and 5V, to be distributed through the same 98-position connector body without shorting risk. This eliminates the need for a separate power connector on space-constrained boards like FPGA development cards, backplane modules, or multi-rail embedded computing platforms.
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