TSM-149-02-H-DV-P-TR SAMTEC Connector (Other) In Stock

The TSM-149-02-H-DV-P-TR is a 98-position dual-row surface-mount terminal strip from SAMTEC with 2.54 mm (0.100") pitch, providing 49 pins per row. Designed for high-density SMT assembly, it features through-hole compatible gold-plated contacts and is supplied on tape-and-reel for automated placement in board-to-board and prototyping interconnect applications.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TSM-149-02-H-DV-P-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
98
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of TSM-149-02-H-DV-P-TR?

  • 98 positions across 2 rows at 2.54 mm (0.100") pitch for maximum pin density
  • Surface-mount (SMT) termination enabling automated pick-and-place assembly
  • Dual-row configuration providing 49 pins per row for high signal count interfaces
  • Gold-plated contacts for low contact resistance and reliable mating across many cycles
  • Tape-and-reel (TR) packaging compatible with reel-fed SMT assembly equipment

What is TSM-149-02-H-DV-P-TR used for?

The TSM-149-02-H-DV-P-TR is used in development boards, FPGA breakout modules, and high-density backplane interconnect assemblies where a large number of signals must be routed through a compact 0.100" pitch header. Its dual-row 98-position count supports complex embedded system designs such as processor daughter cards, memory expansion modules, and evaluation platforms where 49 signals per side must be accessible. The tape-and-reel packaging and SMT footprint make it well suited to volume production PCB assembly using standard reflow soldering processes.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Where can I find the TSM-149-02-H-DV-P-TR datasheet?

TSM-149-02-H-DV-P-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for TSM-149-02-H-DV-P-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many signal contacts does the TSM-149-02-H-DV-P-TR provide per row, and how does the dual-row arrangement benefit dense connector layouts?

The TSM-149-02-H-DV-P-TR provides 49 contacts per row across its 2 rows, for a total of 98 positions at 2.54 mm (0.100") pitch. The dual-row configuration doubles the signal count within the same board footprint length compared to a single-row header, allowing a 49-signal interface to fit in approximately 124 mm of board edge space (49 × 2.54 mm). This is essential for high-pin-count FPGA, microprocessor, or memory bus interfaces where minimizing the connector footprint is critical.

What current and voltage rating does the 2.54 mm SAMTEC TSM series support per contact?

SAMTEC TSM series 0.100" pitch contacts are typically rated at 1A per contact and 250V AC dielectric withstanding voltage. In a 98-position configuration with multiple power and ground pins, the connector can handle total bus currents up to tens of amperes by assigning multiple pins to power rails — a common practice in FPGA and processor board design where VCC and GND rails each take 4 to 8 pins to distribute current and minimize resistance. Individual signal contacts should remain within the 1A-per-pin limit.

How should the TSM-149-02-H-DV-P-TR be reflowed to ensure all 98 contacts solder reliably?

Reflow soldering the TSM-149-02-H-DV-P-TR requires a carefully controlled SAC305 lead-free profile with a peak temperature of 260°C for no more than 10 seconds, per IPC/JEDEC J-STD-020. Because the connector body spans a long 124 mm length, the PCB must be supported to minimize warpage during reflow, and the solder paste stencil should use 0.15 mm apertures to deposit consistent volumes across all 98 pads. X-ray inspection after reflow is recommended to verify solder joint quality on inner row pads hidden under the connector body.

What mating connector family is compatible with the TSM-149-02-H-DV-P-TR for board-to-board and wire-to-board applications?

The TSM series mates with SAMTEC's SSM (surface-mount socket strip) and SFM (fine-pitch socket) families at 0.100" pitch, as well as with industry-standard 2.54 mm dual-row box headers and ribbon cable IDC connectors compliant with DIN 41651. SAMTEC also offers stacking height options from 7.62 mm to over 20 mm in the mating socket series, allowing designers to choose the board separation needed for stacked daughter-card configurations commonly used in Raspberry Pi HATs, Arduino shields, and custom embedded system stacks.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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