TSM-147-01-T-DV-P-TR SAMTEC Connector (Other) In Stock
TSM-147-01-T-DV-P-TR is a 94-position dual-row 2.54 mm pitch SMT terminal strip from SAMTEC with tin-plated contacts and tape-and-reel packaging. It supports standard reflow assembly and is suited for high-density board-to-board signal routing applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- TSM-147-01-T-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-147-01-T-DV-P-TR?
- 94-position dual-row layout on 2.54 mm pitch delivering high signal density in a compact SMT footprint
- Tin-plated contacts providing cost-effective oxidation resistance for commercial-grade board-to-board applications
- Surface-mount termination rated for reflow soldering up to 260°C peak temperature per J-STD-020
- Tape-and-reel packaging enabling seamless integration into high-volume automated SMT assembly lines
- Dual-row design halving PCB edge length versus single-row strips for the same 94-pin count
What is TSM-147-01-T-DV-P-TR used for?
The TSM-147-01-T-DV-P-TR is designed for FPGA development modules, industrial I/O expansion cards, and embedded computing platforms where 94 signals need a compact SMT interface at 2.54 mm pitch. Its tin-plated contacts make it a cost-effective choice for commercial-grade daughter cards and carrier boards used in instrumentation and communication equipment. Tape-and-reel packaging ensures compatibility with automated pick-and-place systems in volume PCB manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-147-01-T-DV-P-TR datasheet?
TSM-147-01-T-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-147-01-T-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the tin plating on the TSM-147-01-T-DV-P-TR differ from gold-plated variants and which designs benefit from each?
The TSM-147-01-T-DV-P-TR uses tin-plated contacts, which offer adequate corrosion resistance for indoor commercial environments at lower cost than gold, making it preferred for high-volume consumer and industrial designs with mating cycles below 30. Gold-plated variants are chosen when mating cycles exceed 100 or when the connector operates in humid or corrosive environments requiring contact resistance below 20 mΩ over the full product life.
What is the contact pitch of the TSM-147-01-T-DV-P-TR and how does this affect PCB routing density?
The TSM-147-01-T-DV-P-TR uses a 2.54 mm pitch between contacts, which is the standard 0.1-inch grid. At this pitch, each row of 47 contacts spans approximately 119 mm of PCB edge, and the dual-row arrangement adds only one additional row of pads at 2.54 mm spacing, enabling 94 signals to be broken out within a footprint that fits a standard 4-layer PCB routing channel without requiring via-in-pad or microvias.
For what reflow temperature profile is the TSM-147-01-T-DV-P-TR rated?
The TSM-147-01-T-DV-P-TR is rated for a peak reflow temperature of 260°C, compliant with the lead-free soldering profile defined in JEDEC J-STD-020. This allows it to be assembled alongside other SMT components on the same board without scheduling a separate lower-temperature oven pass, reducing manufacturing complexity and cycle time for mixed-component assemblies.
In which procurement scenarios is the tape-and-reel -TR suffix of the TSM-147-01-T-DV-P-TR most advantageous?
The -TR suffix indicates tape-and-reel packaging, which is most advantageous when ordering 500 or more units for automated SMT production lines using standard feeder reels. Tape-and-reel eliminates manual connector loading, reduces misalignment and dropped-component defects, and integrates directly with pick-and-place machines calibrated for 2.54 mm pitch SMT strips, lowering per-unit assembly cost at volume.
What signal types and current ratings are appropriate for the TSM-147-01-T-DV-P-TR contacts?
The TSM-147-01-T-DV-P-TR is designed for signal-level connections carrying up to approximately 1 A per contact at voltages consistent with 3.3 V and 5 V logic rails. Each tin-plated contact maintains adequate conductivity for digital I/O, SPI, I2C, UART, and low-speed parallel bus signals. Power pins should be paralleled across multiple contacts when more than 1 A is required to keep individual contact heating within the connector's thermal derating curve.
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