TSM-146-03-STL-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-146-03-STL-DV-P-TR is a 92-position dual-row 2.54 mm pitch surface mount terminal strip with straight lead (STL) termination. Features tape-and-reel packaging for automated pick-and-place SMT assembly and vertical dual-row orientation. Available from authorized distributors worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 92
- Lifecycle
- ACTIVE
- Datasheet
- TSM-146-03-STL-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-146-03-STL-DV-P-TR?
- 92-position dual-row configuration at 2.54 mm (0.100 inch) pitch providing high contact density for surface mount PCB interconnection
- Straight lead (STL) termination style enabling consistent coplanarity for reliable SMT reflow soldering across all 92 contacts
- Tape-and-reel (TR) packaging supporting automated pick-and-place assembly in high-volume SMT production environments
- Vertical dual-row orientation simplifying PCB routing by presenting all 92 contacts in a compact rectangular SMT footprint
What is TSM-146-03-STL-DV-P-TR used for?
The TSM-146-03-STL-DV-P-TR is used in industrial control boards, embedded computing modules, and communication interface cards where a high-density 92-position SMT header is required. Its straight-lead termination ensures solder joint coplanarity critical for reliable reflow in automated production. The tape-and-reel format supports high-volume PCB manufacturing lines serving FPGA boards, data acquisition systems, and backplane interface applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-146-03-STL-DV-P-TR datasheet?
TSM-146-03-STL-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-146-03-STL-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the STL suffix indicate in TSM-146-03-STL-DV-P-TR, and why does it matter for SMT assembly?
The STL suffix in TSM-146-03-STL-DV-P-TR denotes straight lead termination, which ensures all 92 contact legs are coplanar within tight tolerance, typically below 0.1 mm across the full connector length. Consistent coplanarity is essential for surface mount reflow soldering because any non-coplanar pins may not wet properly, resulting in cold joints or open circuits. Straight lead termination makes this connector suitable for fine-pitch SMT reflow processes where all 92 solder joints must form simultaneously in a single pass through the oven.
How does TSM-146-03-STL-DV-P-TR handle a 64-bit bus plus auxiliary signals in a single connector?
With 92 total positions in a dual-row 2.54 mm pitch SMT footprint, the TSM-146-03-STL-DV-P-TR can carry a 64-bit data bus plus 28 additional signals for address lines, control, clock, and power distribution. This avoids the board complexity of routing multiple lower-pin-count headers, reduces connector-to-connector skew, and simplifies PCB layout for parallel bus interfaces operating at 3.3 V or 5 V logic levels on embedded processor and FPGA boards.
What reel quantities and packaging specifications apply to the TSM-146-03-STL-DV-P-TR for production orders?
The TR suffix confirms tape-and-reel packaging for TSM-146-03-STL-DV-P-TR, with reel quantities typically between 250 and 500 pieces per reel as specified by SAMTEC for this series. The tape-and-reel format is compatible with standard 12 mm or wider carrier tape feeders used on automated SMT pick-and-place machines. Ordering in reel quantities reduces per-unit handling cost and supports continuous automated assembly runs without manual component loading interruptions.
When is TSM-146-03-STL-DV-P-TR a better choice than a through-hole dual-row header with the same 92-position count?
The TSM-146-03-STL-DV-P-TR surface mount configuration is preferred over through-hole alternatives when the PCB has no through-hole drilling allowance, when production is fully automated via SMT reflow, or when board thickness constraints prevent 1.6 mm to 2.4 mm through-hole pins. Surface mount placement eliminates wave soldering and reduces assembly steps, lowering per-board cost in production volumes of hundreds or thousands of units. Through-hole alternatives are only preferred when mechanical retention above 10 N pull force is required.
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