TSM-145-01-F-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-145-01-F-DV-P-TR is a 90-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch, offering standard through-hole compatible spacing in SMT form. It features tape-and-reel packaging for automated PCB assembly and a polarized dual-row layout.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 90
- Lifecycle
- ACTIVE
- Datasheet
- TSM-145-01-F-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-145-01-F-DV-P-TR?
- 90-position dual-row SMT terminal strip at 0.100" (2.54 mm) pitch — industry-standard spacing compatible with through-hole footprints
- Tape-and-reel (TR) packaging supports high-volume automated SMT assembly with pick-and-place equipment
- Dual-row (DV) configuration routes 45 signal pairs or 90 single-ended lines within a compact SMT footprint
- Gold-plashed contacts (F finish) ensure low contact resistance under 20 mΩ for reliable signal integrity
What is TSM-145-01-F-DV-P-TR used for?
The TSM-145-01-F-DV-P-TR is designed for standard-pitch board-to-board and wire-to-board interconnect in industrial control systems, embedded computing modules, and backplane systems. Its 0.100" pitch dual-row layout makes it directly compatible with legacy through-hole header footprints, simplifying board redesigns from through-hole to SMT processes. The tape-and-reel packaging makes it suitable for high-volume production runs requiring automated assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-145-01-F-DV-P-TR datasheet?
TSM-145-01-F-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-145-01-F-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the TSM-145-01-F-DV-P-TR use?
The TSM-145-01-F-DV-P-TR has 90 positions arranged in a dual-row layout with a 0.100" (2.54 mm) pitch. This pitch matches the industry-standard 2.54 mm spacing used by DIP headers, allowing it to replace or co-exist with legacy through-hole connectors during a PCB redesign to surface mount technology.
How does the tape-and-reel packaging of TSM-145-01-F-DV-P-TR benefit automated PCB manufacturing?
The -TR suffix designates tape-and-reel packaging, enabling the TSM-145-01-F-DV-P-TR to be fed directly into SMT pick-and-place machines. This reduces manual placement time and supports production volumes exceeding 1,000 boards per run, improving throughput consistency and minimizing placement errors compared to loose-piece or tube packaging formats.
What contact finish does the TSM-145-01-F-DV-P-TR provide and why does it matter?
The 'F' designation indicates a gold-flash contact finish, which provides a contact resistance below 20 mΩ and improves resistance to oxidation. Gold-finish contacts are suitable for low-level signal applications where even small increases in contact resistance could degrade signal integrity, particularly in sensor interface or data bus connections operating at 3.3 V or 5 V logic levels.
In which embedded system applications is the TSM-145-01-F-DV-P-TR commonly used?
The TSM-145-01-F-DV-P-TR is commonly used in industrial backplane systems, embedded controller boards, and test fixture interfaces. Its 90-position 0.100" pitch layout supports high pin-count parallel bus connections operating at signal frequencies up to 100 MHz, and the SMT footprint reduces assembly cost versus through-hole alternatives while maintaining the familiar 2.54 mm grid.
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