TSM-144-03-TL-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-144-03-TL-DV-P-TR is an 88-position dual-row surface-mount terminal strip with 2.54 mm (0.100 inch) pitch, offering reliable high-density interconnects for PCB-to-board mating. Tape-and-reel packaging supports automated SMT assembly with precision placement.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 88
- Lifecycle
- ACTIVE
- Datasheet
- TSM-144-03-TL-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-144-03-TL-DV-P-TR?
- 88 positions in dual-row 2.54 mm pitch layout for high-density SMT board interconnects
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly in high-volume production
- Surface-mount termination style for low-profile, mechanically stable PCB mounting without through-holes
What is TSM-144-03-TL-DV-P-TR used for?
The TSM-144-03-TL-DV-P-TR is suited for board-to-board and mezzanine connector applications in instrumentation, test equipment, and embedded computing modules. Its 88-position dual-row layout accommodates high pin-count interfaces such as FPGA expansion headers, backplane connectors, and daughter-card interfaces. The SMT footprint with tape-and-reel packaging makes it ideal for automated production lines manufacturing industrial and communications hardware.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-144-03-TL-DV-P-TR datasheet?
TSM-144-03-TL-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-144-03-TL-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the TSM-144-03-TL-DV-P-TR have, and what is its pitch?
The TSM-144-03-TL-DV-P-TR features 88 positions arranged in a dual-row configuration on a standard 2.54 mm (0.100 inch) pitch, providing a dense, reliable SMT interconnect solution for high pin-count PCB interfaces in compact assemblies.
What assembly method does the TSM-144-03-TL-DV-P-TR support and how is it packaged?
This SAMTEC connector uses surface-mount termination and is supplied in tape-and-reel (TR) format, enabling automated pick-and-place and reflow soldering. The TR packaging supports production runs requiring precise component placement at 0.100 inch pitch on SMT PCBs.
Which applications benefit most from using the dual-row TSM-144-03-TL-DV-P-TR terminal strip?
Applications such as FPGA daughter-card expansion, mezzanine board stacking, and backplane interconnects benefit most from the TSM-144-03-TL-DV-P-TR. Its 88-position capacity handles wide data buses, and the 2.54 mm pitch ensures compatibility with standard 0.100 inch grid PCB layouts in test and industrial equipment.
How does the TSM-144-03-TL-DV-P-TR compare to through-hole alternatives for the same pin count?
Compared to through-hole dual-row headers at 2.54 mm pitch, the TSM-144-03-TL-DV-P-TR eliminates drilling 88 holes per board, reducing PCB fabrication cost and assembly time. The SMT footprint also allows placement on both PCB sides, saving board area in high-density 88-pin interface designs.
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