TSM-143-04-SM-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-143-04-SM-DV-P-TR is an 86-position dual-row 0.100" (2.54 mm) pitch surface mount terminal strip with surface mount (SM) terminations and dual-voltage compatibility. Features tape-and-reel packaging for automated SMT production lines. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TSM-143-04-SM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-143-04-SM-DV-P-TR?
- 86-position dual-row 0.100" (2.54 mm) pitch SMT terminal strip providing 43 positions per row for high pin-count board interfaces
- Surface mount (SM) termination style with gull-wing leads for stable, inspectable solder joints on standard SMT pads
- Dual-voltage (DV) rating accommodates simultaneous routing of signal-level and power-rail voltages within one connector housing
- Tape-and-reel (TR) packaging enables automated pick-and-place SMT assembly for cost-efficient high-volume production
What is TSM-143-04-SM-DV-P-TR used for?
The TSM-143-04-SM-DV-P-TR is suited for high pin-count board edge interconnects in industrial controllers, server backplanes, and data acquisition systems requiring 86-position dual-row 0.100" pitch SMT terminal strip connections. Its surface mount termination style integrates with standard reflow soldering processes, making it efficient for automated PCB assembly in telecommunications equipment and embedded computing boards. The dual-voltage design allows a single connector to handle both digital I/O signals and moderate power rails, reducing connector count in multi-function backplane and expansion card interfaces.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-143-04-SM-DV-P-TR datasheet?
TSM-143-04-SM-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-143-04-SM-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What distinguishes the SM (surface mount) termination variant of TSM-143-04-SM-DV-P-TR from through-hole TSM versions?
The SM termination on the TSM-143-04-SM-DV-P-TR uses gull-wing SMT leads that solder to PCB surface pads, eliminating the need for drilled through-holes across all 86 positions and reducing PCB fabrication cost compared to through-hole variants. SMT terminations also allow component placement on both sides of the PCB, improving layout flexibility in double-sided assembly processes where board real estate is limited.
How much current can the TSM-143-04-SM-DV-P-TR carry per pin for power distribution?
SAMTEC TSM series connectors at 0.100" (2.54 mm) pitch are typically rated for up to 3 A per contact for power pins and approximately 1 A per signal pin when operated within the standard temperature range of -55°C to +125°C. For the 86-position TSM-143-04-SM-DV-P-TR, total power capacity is determined by the number of pins used for power versus signal, and adjacent high-current pins should be derated based on thermal modeling to prevent connector body heating above rated limits.
Is TSM-143-04-SM-DV-P-TR compatible with lead-free reflow soldering processes?
Yes, the TSM-143-04-SM-DV-P-TR is supplied in tape-and-reel (TR) format and is designed for lead-free reflow soldering at peak temperatures up to 260°C in compliance with J-STD-020 for SMT components. Its gull-wing surface mount terminations are tin or tin-lead plated (per order specification) and maintain coplanarity within standard tolerances across all 86 positions to ensure consistent solder joint formation during reflow.
When is TSM-143-04-SM-DV-P-TR a better fit than the TSM-143-02-S-DV-P-TR for a dual-voltage backplane?
The TSM-143-04-SM-DV-P-TR (SM variant) is preferred over TSM-143-02-S-DV-P-TR (S variant) when the backplane PCB requires surface mount assembly without through-holes, particularly in designs using 4-layer or 6-layer PCBs where routing density through a 86-position via field would cause congestion. The SM termination also provides better coplanarity control for automated optical inspection (AOI) after reflow, whereas single-ended (S) variants may target different pin-exit geometries suited to specific card-edge configurations.
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