TSM-143-03-SM-DV-P-TR SAMTEC Connector (Other) In Stock
The SAMTEC TSM-143-03-SM-DV-P-TR is an 86-position dual-row surface mount terminal strip with a 2.54 mm (0.100 inch) pitch in tape-and-reel packaging with silver-matte contact finish. It provides reliable dual-vertical board-to-board interconnects for SMT production in industrial and embedded computing designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TSM-143-03-SM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-143-03-SM-DV-P-TR?
- 86-position dual-row SMT terminal strip on 2.54 mm (0.100 inch) pitch for high pin-count board-to-board connectivity
- Silver-matte (-SM) contact finish delivers improved solderability and consistent low-resistance mating compared to standard tin finishes
- Tape-and-reel (-TR) packaging enables automated high-volume pick-and-place SMT assembly with consistent component orientation
- Dual-vertical (DV) orientation supports parallel PCB stacking in backplane, motherboard, and module card designs
What is TSM-143-03-SM-DV-P-TR used for?
The TSM-143-03-SM-DV-P-TR is suited for high pin-count SMT board-to-board interconnects in industrial computing modules, embedded single-board computers, and telecom backplane systems requiring 86 parallel signal paths between PCBs. Its silver-matte contact finish ensures repeatable soldering results across large production runs with standard lead-free processes. Tape-and-reel packaging integrates seamlessly into automated SMT lines, reducing placement errors for this fine dual-row layout.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-143-03-SM-DV-P-TR datasheet?
TSM-143-03-SM-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-143-03-SM-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What distinguishes the silver-matte (-SM) contact finish on the TSM-143-03-SM-DV-P-TR from standard tin or gold finishes?
The silver-matte finish provides a solderable surface with lower contact resistance than tin while being more cost-effective than gold. It maintains consistent wettability during lead-free reflow soldering at peak temperatures around 260°C, making it a practical choice for high-volume SMT production lines that require reliable solder joint formation across all 86 positions without the cost premium of gold plating.
How many signals can the TSM-143-03-SM-DV-P-TR carry between two boards, and what pitch does it use?
The TSM-143-03-SM-DV-P-TR provides 86 positions in a dual-row layout on a 2.54 mm (0.100 inch) pitch, offering 43 signal paths per row. This capacity is sufficient for 32-bit parallel buses with additional ground, power, and handshaking lines — a typical requirement for processor-to-FPGA or CPU-to-memory module interconnects in embedded computing boards.
What production advantages does tape-and-reel packaging give for the TSM-143-03-SM-DV-P-TR?
Tape-and-reel packaging (-TR) presents each 86-position connector in a standardized carrier that feeds directly into SMT pick-and-place machines. This ensures consistent orientation, prevents manual handling damage to the fine dual-row contacts, and supports line throughput of hundreds of placements per hour — critical for cost-effective high-volume production of backplane or industrial controller PCBs.
When should TSM-143-03-SM-DV-P-TR be chosen over the TSM-143-01-G-DV-P-TR variant?
The TSM-143-03-SM-DV-P-TR with silver-matte finish is preferred when cost is a greater constraint than contact finish performance and when 86-position board-to-board connectivity is needed at 2.54 mm pitch. The TSM-143-01-G-DV-P-TR with gold plating suits designs requiring lower contact resistance below 10 mΩ or more than 500 mating cycles, such as hot-swap or frequently serviced modules. For standard fixed interconnects assembled once in production, the silver-matte variant offers sufficient reliability at lower component cost.
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