TSM-143-03-S-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-143-03-S-DV-P-TR is an 86-position dual-row surface-mount terminal strip with 0.100" pitch, vertical dual-beam contacts, and tape-and-reel packaging for high-volume automated SMT assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TSM-143-03-S-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-143-03-S-DV-P-TR?
- 86-position dual-row SMT terminal strip at 0.100" pitch enabling reliable high-density board-to-board mating
- Dual-beam vertical (DV) contact design provides redundant contact wiping for improved signal reliability over 500+ mating cycles
- Tape-and-reel (TR) packaging supports high-volume automated pick-and-place SMT assembly with consistent component orientation
What is TSM-143-03-S-DV-P-TR used for?
The TSM-143-03-S-DV-P-TR is well suited for backplane interconnect, modular PCB stacking, and industrial controller applications requiring 86 positions at a standard 0.100" pitch. Its dual-beam contact design ensures consistent low-resistance connections in environments subject to moderate vibration or thermal cycling. The tape-and-reel option makes it a natural choice for automated production lines where placement accuracy and throughput are paramount.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-143-03-S-DV-P-TR datasheet?
TSM-143-03-S-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-143-03-S-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the dual-beam vertical (DV) contact configuration in the TSM-143-03-S-DV-P-TR contribute to signal integrity?
The dual-beam vertical contact design in the TSM-143-03-S-DV-P-TR provides two independent contact wipe points per pin, which reduces the risk of intermittent connections caused by particulate contamination or slight misalignment. Each beam independently engages the mating pin, helping maintain contact resistance below 20 mΩ across the full 86-position array at 0.100" pitch, which is essential in data acquisition and control systems with dense signal routing.
For a high-volume production line, how does the tape-and-reel format of the TSM-143-03-S-DV-P-TR improve manufacturing efficiency?
The tape-and-reel (TR) packaging of the TSM-143-03-S-DV-P-TR ensures consistent component orientation for automated pick-and-place machines, eliminating manual loading steps that introduce placement errors. Standard reel pitch compatibility allows the part to feed directly into SMT lines without additional tooling, supporting production volumes of thousands of units per shift for 86-position dual-row SMT terminal strips at 0.100" pitch.
When is TSM-143-03-S-DV-P-TR a better fit than a through-hole terminal strip for the same 86-pin interface?
The SMT configuration of the TSM-143-03-S-DV-P-TR is preferred over through-hole alternatives when PCB thickness is constrained below 1.6 mm or when wave-soldering is not available in the production flow. SMT placement also avoids drilling 86 pairs of through-holes, reducing PCB fabrication cost and allowing signal traces on all inner layers beneath the connector footprint. The 0.100" pitch dual-row layout fits standard SMT land patterns without custom pad design.
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