TSM-143-02-T-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-143-02-T-DV-P-TR is an 86-position dual-row 2.54 mm (0.100 inch) pitch surface mount terminal strip with tin-plated contacts. Rated at 3 A per contact from -55°C to +125°C, it ships in tape-and-reel packaging compatible with automated SMT pick-and-place assembly for cost-effective high-volume production.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TSM-143-02-T-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-143-02-T-DV-P-TR?
- 86-position dual-row 2.54 mm pitch SMT terminal strip with tin (T) contact plating for cost-efficient high-volume PCB interconnect
- 3 A per contact current rating in DV vertical orientation supports combined power and signal distribution on industrial and computing boards
- Tape-and-reel (TR) packaging enables fully automated pick-and-place SMT assembly compatible with standard reflow soldering processes
What is TSM-143-02-T-DV-P-TR used for?
TSM-143-02-T-DV-P-TR is used in industrial automation controllers, rack-mount server backplanes, and embedded computing boards where an 86-position dual-row 2.54 mm SMT terminal strip with cost-effective tin plating is required. The 3 A per contact rating supports power and signal routing in high-density PCB designs for telecommunications and data acquisition systems. Its tape-and-reel packaging streamlines automated SMT assembly for medium to high production volumes.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-143-02-T-DV-P-TR datasheet?
TSM-143-02-T-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-143-02-T-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the tin (T) contact plating of TSM-143-02-T-DV-P-TR affect its suitability compared to gold-plated variants?
Tin-plated contacts on TSM-143-02-T-DV-P-TR provide adequate performance for applications with fewer than 25 mating cycles and contact forces above 100 g per pin, making them ideal for cost-sensitive backplane assemblies in industrial equipment where gold plating would increase component cost unnecessarily.
What is the pin count and pitch of TSM-143-02-T-DV-P-TR, and how does it fit a standard PCB grid?
TSM-143-02-T-DV-P-TR has 86 positions in 2 rows of 43 pins each at 2.54 mm (0.100 inch) pitch. This standard 0.100 inch grid aligns with IPC-7351 land patterns and allows direct substitution with through-hole equivalents on converted SMT PCB designs without layout changes.
For server backplane designs, when is TSM-143-02-T-DV-P-TR preferred over a through-hole terminal strip?
TSM-143-02-T-DV-P-TR is preferred when the backplane requires double-sided SMT component placement or when board thickness must remain below 1.6 mm, as the surface mount form factor eliminates through-holes and reduces drill-cycle time. Its 3 A per pin and -55°C to +125°C rating match typical server environment demands.
What reflow soldering profile is recommended for assembling TSM-143-02-T-DV-P-TR?
TSM-143-02-T-DV-P-TR supports lead-free reflow soldering with a peak temperature of 260°C and time above 217°C liquidus of 60 to 90 seconds, consistent with IPC/JEDEC J-STD-020 MSL 1 requirements. The standard SMT 2.54 mm pitch land pattern accommodates no-clean or water-wash flux processes.
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