TSM-143-02-S-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-143-02-S-DV-P-TR is an 86-position dual-row 0.100" (2.54 mm) pitch surface mount terminal strip connector with single-ended contacts. Features dual-voltage compatibility and tape-and-reel packaging for automated SMT production. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TSM-143-02-S-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-143-02-S-DV-P-TR?
- 86-position dual-row 0.100" (2.54 mm) pitch SMT terminal strip for high pin-count board interconnects
- Single-ended (S) contact configuration simplifies signal routing and reduces crosstalk in low-frequency applications
- Dual-voltage (DV) design accommodates mixed signal and power rail routing within a single connector footprint
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly for cost-efficient high-volume SMT production
What is TSM-143-02-S-DV-P-TR used for?
The TSM-143-02-S-DV-P-TR is used in backplane assemblies, industrial control panels, and test fixture boards requiring high pin-count 0.100" pitch SMT terminal connections with 86 positions across dual rows. Its single-ended contact design suits signal distribution boards in telecommunications racks, embedded computing platforms, and data acquisition systems where power and signal rails coexist. The tape-and-reel format supports high-volume automated assembly in server hardware and industrial electronics manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-143-02-S-DV-P-TR datasheet?
TSM-143-02-S-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-143-02-S-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the TSM-143-02-S-DV-P-TR differ from dual-ended TSM variants for backplane applications?
The TSM-143-02-S-DV-P-TR uses single-ended (S) contacts, meaning signal enters and exits from one side, whereas dual-ended variants support pass-through connections between two boards. For backplane designs with 86 positions and 0.100" pitch, the single-ended configuration offers simpler termination and lower insertion loss at frequencies below 500 MHz, making it the preferred choice for power distribution and digital I/O routing in industrial control and data acquisition systems.
What current rating per pin should designers plan for with the TSM-143-02-S-DV-P-TR?
SAMTEC TSM series 0.100" pitch surface mount terminal strips typically support 2 A to 3 A per contact for power pins and 1 A per contact for signal pins when used within the rated operating temperature range of -55°C to +125°C. For the 86-position TSM-143-02-S-DV-P-TR, designers should derate current per pin when multiple adjacent pins carry current simultaneously to avoid thermal buildup in the dual-row connector body.
Which soldering process is recommended for the SMT TSM-143-02-S-DV-P-TR terminal strip?
The TSM-143-02-S-DV-P-TR is designed for surface mount reflow soldering using standard lead-free solder paste with a peak reflow temperature up to 260°C per J-STD-020. Its tape-and-reel packaging ensures consistent component orientation for automated pick-and-place placement across all 86 positions, and the SMT gull-wing or J-lead terminations maintain coplanarity within tolerance to produce reliable solder joints in a single reflow pass.
Can TSM-143-02-S-DV-P-TR be used in mixed power and signal dual-voltage applications?
Yes, the dual-voltage (DV) designation on the TSM-143-02-S-DV-P-TR indicates the connector is rated to carry both signal-level voltages (typically 3.3 V or 5 V logic) and moderate power rail voltages within the same 86-position dual-row housing. This allows a single connector to replace 2 separate connectors in designs where power and signal lines must share the same board edge interface, reducing component count and board-edge real estate by up to 50% in mixed-function backplane designs.
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