TSM-143-02-H-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-143-02-H-DV-P-TR is an 86-position dual-row surface-mount terminal strip at 0.100-inch pitch with horizontal orientation, offering a high contact count for compact board-to-board and backplane signal routing in SMT assemblies.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TSM-143-02-H-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-143-02-H-DV-P-TR?
- 86 positions in dual-row horizontal (H) configuration at 0.100" (2.54 mm) pitch
- Surface-mount termination compatible with standard reflow soldering and automated SMT assembly
- Tape-and-reel (TR) packaging for seamless integration into high-volume pick-and-place production
- Horizontal dual-row orientation reduces connector height profile on space-constrained PCBs
- High contact density supports simultaneous routing of power, data, and control signals
What is TSM-143-02-H-DV-P-TR used for?
The TSM-143-02-H-DV-P-TR suits low-profile backplane designs, stacked PCB assemblies, and embedded computing modules where a horizontal 86-position SMT connector minimizes overall assembly height. The 0.100-inch pitch aligns with standard PCB design libraries, simplifying layout and reducing design iterations. It is commonly used in industrial control systems, network equipment, and FPGA carrier boards requiring high-density, reliable signal interconnects.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-143-02-H-DV-P-TR datasheet?
TSM-143-02-H-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-143-02-H-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact pitch and pin count of TSM-143-02-H-DV-P-TR for board-to-board designs?
The TSM-143-02-H-DV-P-TR offers 86 contact positions at a 0.100-inch (2.54 mm) pitch in a dual-row arrangement, giving designers a high-density interconnect option that routes multiple buses, power rails, and control signals through a single compact SMT connector body.
How does the horizontal (H) orientation of TSM-143-02-H-DV-P-TR differ from the FM-DV variant?
The H designation indicates a horizontal lead exit, lowering the connector profile compared to vertical-exit variants. This allows TSM-143-02-H-DV-P-TR to be used in slim-form-factor assemblies or stacked PCB configurations where overall height must stay within a few millimeters above the PCB surface.
Which high-density signal routing scenarios benefit most from TSM-143-02-H-DV-P-TR's 86-position capacity?
Backplane interfaces, FPGA daughter-card connections, and multi-bus processor modules benefit from 86 contacts at 0.100-inch pitch because a single connector can carry parallel data buses up to 32 bits wide, plus addressing, control, and power lines simultaneously without requiring multiple smaller connectors.
Is TSM-143-02-H-DV-P-TR available in tape-and-reel format for automated manufacturing?
Yes, the TR suffix confirms tape-and-reel packaging, enabling automated pick-and-place assembly of the TSM-143-02-H-DV-P-TR on standard SMT lines. This packaging minimizes handling errors, maintains consistent component orientation, and supports throughput requirements in high-volume PCB manufacturing environments.
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