TSM-143-02-FM-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-143-02-FM-DV-P-TR is an 86-position dual-row surface-mount terminal strip with 0.100-inch pitch, offering high contact density in a compact SMT footprint for backplane, motherboard, and high-pin-count board-to-board interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TSM-143-02-FM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-143-02-FM-DV-P-TR?
- 86 positions in dual-row layout at 0.100" (2.54 mm) pitch for high-density interconnect
- Surface-mount termination for automated SMT assembly and reflow soldering compatibility
- Tape-and-reel packaging (TR suffix) supporting high-volume pick-and-place production
- Dual-row configuration maximizes contact count per connector length on constrained PCB areas
- Vertical (DV) orientation for through-card signal routing on dense multi-layer boards
What is TSM-143-02-FM-DV-P-TR used for?
The TSM-143-02-FM-DV-P-TR is designed for backplane connectors, motherboard expansion slots, and high-density board-to-board signal routing where 86 contacts are needed in a surface-mount form factor. Its standard 0.100-inch pitch makes it compatible with common PCB design rules and typical SMT pad libraries. Tape-and-reel delivery suits automated assembly lines in industrial computing, networking infrastructure, and embedded systems manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-143-02-FM-DV-P-TR datasheet?
TSM-143-02-FM-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-143-02-FM-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal connections does TSM-143-02-FM-DV-P-TR provide and what is the contact pitch?
The TSM-143-02-FM-DV-P-TR offers 86 positions arranged in a dual-row layout at 0.100-inch (2.54 mm) pitch, providing a high contact count suitable for complex backplane and motherboard interconnect designs requiring many simultaneous signal paths.
For a multi-layer PCB backplane design, what mounting style does TSM-143-02-FM-DV-P-TR use?
This terminal strip uses surface-mount (SMT) termination with vertical dual-row layout, allowing reflow soldering on standard SMT production lines. The 86 contacts at 0.100-inch pitch integrate cleanly into multi-layer backplane designs without requiring through-hole drilling.
When would TSM-143-02-FM-DV-P-TR be chosen over a lower-pin-count SAMTEC terminal strip?
Designers select the 86-position TSM-143-02-FM-DV-P-TR when a single connector must route power rails, multiple data buses, and GPIO signals simultaneously, such as in FPGA daughter-card interfaces or industrial computing backplanes requiring more than 40 positions per connector.
Does the TR packaging suffix on TSM-143-02-FM-DV-P-TR confirm tape-and-reel availability for automated assembly?
Yes, the TR suffix designates tape-and-reel packaging for the TSM-143-02-FM-DV-P-TR, confirming compatibility with automated pick-and-place equipment. This packaging is standard for SMT connectors in high-volume manufacturing environments where consistent component orientation and feed rates are critical.
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