TSM-143-01-G-DV-P-TR SAMTEC Connector (Other) In Stock
The SAMTEC TSM-143-01-G-DV-P-TR is an 86-position dual-row surface mount terminal strip with a 2.54 mm (0.100 inch) pitch in tape-and-reel packaging. It features gold-plated contacts and dual-vertical orientation for reliable board-to-board signal interconnects in automated SMT production.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TSM-143-01-G-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-143-01-G-DV-P-TR?
- 86-position dual-row SMT terminal strip on 2.54 mm (0.100 inch) pitch supports high pin-count board-to-board connections
- Gold (-G) plated contacts provide low contact resistance and extended mating cycle life compared to tin-finished alternatives
- Tape-and-reel (-TR) packaging enables automated high-volume pick-and-place SMT assembly
- Dual-vertical (DV) orientation allows parallel board stacking in backplane and daughtercard applications
What is TSM-143-01-G-DV-P-TR used for?
The TSM-143-01-G-DV-P-TR is designed for high pin-count SMT board-to-board interconnects in industrial computing, embedded systems, and telecom equipment that require 86 parallel signal paths between PCBs. Gold-plated contacts make it especially suitable for applications with hundreds of mating cycles or low-level signal environments where contact resistance stability is critical. Tape-and-reel packaging makes it a natural fit for automated SMT lines producing high volumes of backplane or motherboard assemblies.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-143-01-G-DV-P-TR datasheet?
TSM-143-01-G-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-143-01-G-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does the TSM-143-01-G-DV-P-TR use and why does it matter?
The -G suffix designates gold-plated contacts, providing lower and more stable contact resistance than tin alternatives. Gold plating is critical for low-level signal applications such as 3.3 V logic buses and in connectors expected to undergo hundreds of mate/unmate cycles without measurable degradation in electrical performance.
How does the TSM-143-01-G-DV-P-TR's dual-row layout benefit high-density PCB designs?
With 86 positions arranged in 2 rows at a 2.54 mm pitch, the TSM-143-01-G-DV-P-TR routes 43 signals per row within a compact linear footprint. This dual-row architecture reduces the board edge length needed for high-count I/O compared to single-row solutions, freeing PCB area for additional circuitry in backplane and module card designs.
What assembly advantages does the tape-and-reel packaging of TSM-143-01-G-DV-P-TR provide?
The -TR suffix indicates tape-and-reel packaging compatible with standard SMT pick-and-place machines. This format maintains consistent component orientation and pitch spacing across a reel containing hundreds of connectors, enabling automated placement at rates suitable for high-volume production without manual handling of individual parts.
Which mating connector families are compatible with the TSM-143-01-G-DV-P-TR?
The TSM-143-01-G-DV-P-TR mates with SAMTEC TFM or CLM series receptacles at the 2.54 mm pitch. The dual-vertical (DV) configuration supports stacking two PCBs in parallel, with mating board-to-board stack heights depending on the paired receptacle, typically ranging from 8 mm to 23 mm for standard SAMTEC mating pairs.
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