TSM-142-05-T-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-142-05-T-DV-P-TR is an 84-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch, tin-plated contacts, dual-vertical orientation, and tape-and-reel packaging for automated assembly. It provides a reliable PCB-mount header solution for high pin-count digital and power signal interconnects.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 84
- Lifecycle
- ACTIVE
- Datasheet
- TSM-142-05-T-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-142-05-T-DV-P-TR?
- 84-position dual-row layout at 0.100" (2.54 mm) pitch accommodates high-density signal routing on standard 2.54 mm grid PCBs
- Tin-plated (T) contacts offer a cost-effective, solderable surface for reliable SMT reflow assembly
- Dual-vertical (DV) orientation provides flexible mating direction for both board-to-board and wire-to-board configurations
- Tape-and-reel (TR) packaging ensures compatibility with automated pick-and-place machines in volume SMT production
What is TSM-142-05-T-DV-P-TR used for?
The TSM-142-05-T-DV-P-TR is well suited for industrial automation controllers, embedded computing expansion boards, and telecommunications equipment requiring high pin-count 0.100" pitch SMT headers. Its 84-position dual-row format supports dense backplane interfaces, parallel data bus connections, and modular power distribution headers in both commercial and industrial grade PCB assemblies.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-142-05-T-DV-P-TR datasheet?
TSM-142-05-T-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-142-05-T-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact pitch and total pin count of the TSM-142-05-T-DV-P-TR, and how does this affect PCB layout?
The TSM-142-05-T-DV-P-TR features 84 pins arranged in a dual-row format at 0.100" (2.54 mm) pitch, occupying approximately 42 positions per row and fitting the standard 2.54 mm grid PCB layout, making it straightforward to route wide parallel buses on multilayer boards without custom footprint design.
For which industrial or embedded computing applications is the TSM-142-05-T-DV-P-TR particularly suitable?
The TSM-142-05-T-DV-P-TR is particularly suited for PLC backplane buses, FPGA parallel interface headers, industrial gateway boards, and modular compute modules that require 84-pin dual-row SMT connectivity at 0.100" (2.54 mm) pitch, providing low-resistance signal paths across multiple high-speed data lanes.
How does tin plating on the TSM-142-05-T-DV-P-TR compare to gold plating for SMT reflow assembly?
Tin-plated contacts on the TSM-142-05-T-DV-P-TR wet easily during reflow soldering and form reliable intermetallic bonds with standard SAC305 solder at typical reflow peak temperatures of 245°C to 260°C, making them cost-effective for high-volume 84-position SMT assemblies where repeated mating cycles are not the primary concern.
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