TSM-142-02-SM-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-142-02-SM-DV-P-TR is an 84-position dual-row 0.100 inch (2.54 mm) pitch surface-mount terminal strip designed for wide-bus board-to-board signal interfaces. SM suffix denotes surface-mount termination with reflow compatibility. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 84
- Lifecycle
- ACTIVE
- Datasheet
- TSM-142-02-SM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 84-position dual-row layout at 0.100 inch (2.54 mm) pitch enabling standard-grid wide-bus signal and power distribution
- Surface-mount SM termination is fully compatible with standard reflow soldering processes at up to 260°C peak temperature
- Tape-and-reel packaging supports automated pick-and-place assembly for consistent, high-volume PCB production
Applications
TSM-142-02-SM-DV-P-TR is used in industrial computing backplanes, embedded system carrier boards, and multi-channel data acquisition modules requiring an 84-pin dual-row SMT terminal connection at standard 0.100 inch pitch. Its 42-position-per-row layout supports wide parallel data buses, mixed power-and-signal assignments, and multi-rail power distribution. The SMT design enables dense assembly alongside fine-pitch ICs and passives on modern PCBs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the SM suffix indicate in TSM-142-02-SM-DV-P-TR and how does it differ from through-hole TSM variants?
The SM suffix on TSM-142-02-SM-DV-P-TR indicates surface-mount termination, meaning the 84 contact tails are designed for SMT reflow soldering at peak temperatures up to 260°C rather than through-hole wave soldering. This eliminates the need to drill 84 holes per connector in the PCB, reducing board fabrication cost and enabling placement of components on both sides of the PCB beneath the connector footprint.
For an 84-signal industrial backplane design, how does TSM-142-02-SM-DV-P-TR's 0.100 inch pitch simplify impedance-controlled routing?
At 0.100 inch (2.54 mm) pitch, TSM-142-02-SM-DV-P-TR allows trace routing between the 84 pins using standard 4-mil trace and 6-mil space design rules, achieving controlled impedance of approximately 50 ohms without requiring advanced HDI PCB processes. This contrasts with 0.050 inch pitch connectors that demand tighter 3-mil or finer trace rules and more PCB laminate stack-up tuning for the same 50-ohm target.
How does the 84-position count of TSM-142-02-SM-DV-P-TR compare to adjacent TSM variants for selecting the right pin count?
TSM-142-02-SM-DV-P-TR occupies the TSM-142 position with 84 pins, sitting between TSM-141 (82 pins) and TSM-143 (86 pins) in the SAMTEC TSM series, with all variants sharing the dual-row 0.100 inch (2.54 mm) pitch SMT footprint. Designers select TSM-142 when bus width plus power and ground assignments total 42 per row, avoiding the need to leave unused pins on a larger variant or accommodate too few signals on the 82-pin TSM-141.
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