TSM-142-02-G-DV-P-TR SAMTEC Connector (Other) In Stock
TSM-142-02-G-DV-P-TR is an 84-position dual-row 2.54 mm pitch surface-mount terminal strip from SAMTEC with gold-plated contacts and tape-and-reel packaging. Its dual-voltage DV configuration supports mixed voltage rails and it is optimized for automated SMT assembly in volume production.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 84
- Lifecycle
- ACTIVE
- Datasheet
- TSM-142-02-G-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-142-02-G-DV-P-TR?
- 84 positions in a dual-row 2.54 mm pitch layout providing versatile SMT board-to-board signal routing
- Gold-plated contacts ensuring low contact resistance and high reliability across 100+ mating cycles
- Dual-voltage (DV) configuration supporting mixed 3.3 V and 5 V logic rail interconnect on a single strip
- Tape-and-reel (-TR) packaging enabling seamless high-volume pick-and-place SMT assembly line integration
- Surface-mount reflow compatible up to 260°C peak temperature for single-pass lead-free assembly
What is TSM-142-02-G-DV-P-TR used for?
The TSM-142-02-G-DV-P-TR is deployed in FPGA evaluation boards, industrial I/O carrier cards, and embedded computing modules where 84 mixed-voltage signals must be routed across a board-to-board interface at 2.54 mm pitch. Its gold-plated contacts make it suitable for field-upgradeable daughter cards and development platforms with repeated mating cycles. Tape-and-reel packaging supports high-volume PCB assembly for industrial automation, telecommunications equipment, and test and measurement instruments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-142-02-G-DV-P-TR datasheet?
TSM-142-02-G-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-142-02-G-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the DV designation in TSM-142-02-G-DV-P-TR indicate about its electrical configuration?
The DV designation indicates a dual-voltage configuration, meaning the 84-position strip is partitioned to support two different logic voltage levels — typically 3.3 V and 5 V — on separate rows or pin groups within the same connector. This allows designers to route mixed-voltage signals from FPGA I/O banks and legacy TTL peripherals through a single 2.54 mm pitch interface without requiring separate connectors for each voltage domain.
How does the gold plating on the TSM-142-02-G-DV-P-TR contacts compare to tin plating for high-cycle daughter card designs?
Gold-plated contacts on the TSM-142-02-G-DV-P-TR maintain contact resistance below 20 mΩ over a minimum of 100 mating cycles, whereas tin-plated contacts typically degrade after 30 cycles as tin oxide forms on the contact surface. For development boards and field-replaceable modules that undergo frequent daughter card swaps during prototyping or maintenance, the gold finish prevents intermittent connections and avoids the need for periodic connector replacement.
How many positions per row does the TSM-142-02-G-DV-P-TR provide and what PCB edge length does this require?
The TSM-142-02-G-DV-P-TR provides 42 positions per row in a dual-row arrangement, with rows spaced at 2.54 mm pitch. At 2.54 mm contact pitch, 42 positions per row span approximately 107 mm of PCB edge length, and the dual-row adds a second row of pads at 2.54 mm offset. Designers must allocate a keep-out zone of roughly 115 x 8 mm on the PCB to accommodate the connector body and solder land patterns.
For which procurement and production scenarios is the tape-and-reel TSM-142-02-G-DV-P-TR most cost-effective?
The -TR tape-and-reel suffix makes the TSM-142-02-G-DV-P-TR most cost-effective when production volumes exceed 500 units per run, as reel packaging eliminates manual component feeding and reduces placement defect rates for the 2.54 mm pitch pads. For prototype or low-volume builds under 100 units, tray or tube packaging may be more practical since partial reels often incur setup and reel-splitting fees that increase per-unit cost without proportional assembly efficiency gains.
Can the TSM-142-02-G-DV-P-TR withstand standard lead-free reflow oven temperatures, and what precautions are needed?
Yes, the TSM-142-02-G-DV-P-TR is rated for lead-free reflow soldering with a peak board temperature of 260°C for up to 30 seconds, compliant with J-STD-020. To prevent co-planarity loss across all 84 contacts during reflow, the PCB must be flat to within 0.1 mm and the solder paste deposit height must be uniform within ±0.05 mm; uneven paste can cause lifted contacts on the 2.54 mm pitch pads after the connector body settles during solder reflow.
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