TSM-141-04-SM-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-141-04-SM-DV-P-TR is an 82-position dual-row surface-mount terminal strip with 0.100 inch pitch, dual-voltage variant, and tape-and-reel packaging for automated SMT assembly. From $5.00 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- TSM-141-04-SM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-141-04-SM-DV-P-TR?
- 82-position dual-row surface-mount terminal strip at 0.100 inch (2.54 mm) pitch providing 41 contacts per row for high-pin-count board-to-board or wire-to-board connectivity
- Dual-voltage (DV suffix) design supporting mixed voltage planes across the connector body, enabling simultaneous routing of multiple power domains and signal nets
- Tape-and-reel (TR) packaging for fully automated SMT pick-and-place assembly with compatibility for lead-free reflow soldering up to 260°C peak
What is TSM-141-04-SM-DV-P-TR used for?
The SAMTEC TSM-141-04-SM-DV-P-TR surface-mount terminal strip is suitable for backplane-to-mezzanine connections, industrial controller I/O expansion boards, and development platform interfaces requiring 82 mixed-signal and power connections at 0.100 inch pitch. Its dual-voltage variant allows designers to partition the connector body for different voltage domains, simplifying power distribution in multi-rail embedded computing systems. The tape-and-reel packaging supports automated SMT production for telecom equipment, test fixtures, and high-channel-count data acquisition hardware.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-141-04-SM-DV-P-TR datasheet?
TSM-141-04-SM-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-141-04-SM-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the DV (dual-voltage) suffix mean for the TSM-141-04-SM-DV-P-TR and how does it affect PCB layout?
The DV (dual-voltage) suffix on the TSM-141-04-SM-DV-P-TR indicates the connector body is designed to accommodate two separate voltage planes across its 82 positions, typically split into isolated sections. This allows a PCB layout to route a 3.3 V rail through one half of the connector and a 5 V or 12 V rail through the other, without requiring separate connectors for each voltage domain at 0.100 inch (2.54 mm) pitch.
How does the 0.100 inch pitch of the TSM-141-04-SM-DV-P-TR compare to the 0.050 inch pitch SFM series for backplane designs?
The TSM-141-04-SM-DV-P-TR uses 0.100 inch (2.54 mm) pitch, which is twice the spacing of the 0.050 inch SFM series, resulting in a wider PCB footprint for 82 positions but with larger pad sizes that allow higher current per contact — typically 1 A to 3 A per pin versus under 1 A for 0.050 inch pitch connectors. The larger pitch also simplifies manual inspection and rework, making it preferred for industrial control panels and development boards where serviceability matters.
What current-carrying capacity per contact can be expected from the TSM-141-04-SM-DV-P-TR at 0.100 inch pitch?
At 0.100 inch (2.54 mm) pitch, the TSM-141-04-SM-DV-P-TR contacts support current ratings typically between 1 A and 3 A per pin depending on the contact cross-section and plating. For an 82-position connector with dedicated power contacts, this allows distributing 10 A or more to a mezzanine board when 5 or more contacts per rail are used, supporting moderate-power embedded processors and FPGAs drawing up to 15 W from a 3.3 V or 5 V supply.
Which automated assembly process best accommodates the 82-position footprint of the TSM-141-04-SM-DV-P-TR?
The TSM-141-04-SM-DV-P-TR in tape-and-reel (TR) packaging is optimized for automated SMT pick-and-place assembly, where placement accuracy within ±0.1 mm ensures correct registration of all 82 contacts at 0.100 inch (2.54 mm) pitch before reflow soldering at 260°C peak. Stencil printing with a solder paste deposit matching the 2.54 mm pad pitch is recommended, and a reflow profile with a 60-second dwell above 217°C ensures complete solder joint formation across the full 82-pin row length.
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