TSM-141-04-SM-DV-P-TR SAMTEC Connector (Other) In Stock

SAMTEC TSM-141-04-SM-DV-P-TR is an 82-position dual-row surface-mount terminal strip with 0.100 inch pitch, dual-voltage variant, and tape-and-reel packaging for automated SMT assembly. From $5.00 in stock with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TSM-141-04-SM-DV-P-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
82
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of TSM-141-04-SM-DV-P-TR?

  • 82-position dual-row surface-mount terminal strip at 0.100 inch (2.54 mm) pitch providing 41 contacts per row for high-pin-count board-to-board or wire-to-board connectivity
  • Dual-voltage (DV suffix) design supporting mixed voltage planes across the connector body, enabling simultaneous routing of multiple power domains and signal nets
  • Tape-and-reel (TR) packaging for fully automated SMT pick-and-place assembly with compatibility for lead-free reflow soldering up to 260°C peak

What is TSM-141-04-SM-DV-P-TR used for?

The SAMTEC TSM-141-04-SM-DV-P-TR surface-mount terminal strip is suitable for backplane-to-mezzanine connections, industrial controller I/O expansion boards, and development platform interfaces requiring 82 mixed-signal and power connections at 0.100 inch pitch. Its dual-voltage variant allows designers to partition the connector body for different voltage domains, simplifying power distribution in multi-rail embedded computing systems. The tape-and-reel packaging supports automated SMT production for telecom equipment, test fixtures, and high-channel-count data acquisition hardware.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Where can I find the TSM-141-04-SM-DV-P-TR datasheet?

TSM-141-04-SM-DV-P-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for TSM-141-04-SM-DV-P-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What does the DV (dual-voltage) suffix mean for the TSM-141-04-SM-DV-P-TR and how does it affect PCB layout?

The DV (dual-voltage) suffix on the TSM-141-04-SM-DV-P-TR indicates the connector body is designed to accommodate two separate voltage planes across its 82 positions, typically split into isolated sections. This allows a PCB layout to route a 3.3 V rail through one half of the connector and a 5 V or 12 V rail through the other, without requiring separate connectors for each voltage domain at 0.100 inch (2.54 mm) pitch.

How does the 0.100 inch pitch of the TSM-141-04-SM-DV-P-TR compare to the 0.050 inch pitch SFM series for backplane designs?

The TSM-141-04-SM-DV-P-TR uses 0.100 inch (2.54 mm) pitch, which is twice the spacing of the 0.050 inch SFM series, resulting in a wider PCB footprint for 82 positions but with larger pad sizes that allow higher current per contact — typically 1 A to 3 A per pin versus under 1 A for 0.050 inch pitch connectors. The larger pitch also simplifies manual inspection and rework, making it preferred for industrial control panels and development boards where serviceability matters.

What current-carrying capacity per contact can be expected from the TSM-141-04-SM-DV-P-TR at 0.100 inch pitch?

At 0.100 inch (2.54 mm) pitch, the TSM-141-04-SM-DV-P-TR contacts support current ratings typically between 1 A and 3 A per pin depending on the contact cross-section and plating. For an 82-position connector with dedicated power contacts, this allows distributing 10 A or more to a mezzanine board when 5 or more contacts per rail are used, supporting moderate-power embedded processors and FPGAs drawing up to 15 W from a 3.3 V or 5 V supply.

Which automated assembly process best accommodates the 82-position footprint of the TSM-141-04-SM-DV-P-TR?

The TSM-141-04-SM-DV-P-TR in tape-and-reel (TR) packaging is optimized for automated SMT pick-and-place assembly, where placement accuracy within ±0.1 mm ensures correct registration of all 82 contacts at 0.100 inch (2.54 mm) pitch before reflow soldering at 260°C peak. Stencil printing with a solder paste deposit matching the 2.54 mm pad pitch is recommended, and a reflow profile with a 60-second dwell above 217°C ensures complete solder joint formation across the full 82-pin row length.

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AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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