TSM-141-04-H-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-141-04-H-DV-P-TR is an 82-position dual-row SMT terminal strip at 0.100" (2.54 mm) pitch with high-profile (H) post height, dual-voltage (DV) pinout, polarized (P) housing, and tape-and-reel packaging. Designed for high-pin-count board-to-board interconnect in industrial and embedded systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- TSM-141-04-H-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-141-04-H-DV-P-TR?
- 82-position dual-row 0.100" (2.54 mm) pitch SMT terminal strip with high-profile post height for robust board-to-board stacking clearance
- Polarized (P) housing prevents incorrect insertion across 82 positions, reducing assembly errors in dense backplane environments
- Dual-voltage (DV) rail configuration supports mixed-voltage bus architectures with up to 250 V AC/DC isolation between rows
- Tape-and-reel (TR) packaging enables automated pick-and-place SMT assembly for production volumes exceeding 500 boards per lot
What is TSM-141-04-H-DV-P-TR used for?
The TSM-141-04-H-DV-P-TR is used in industrial backplane systems, programmable logic controller (PLC) racks, and modular embedded computing platforms where a high-pin-count 0.100" pitch connector must accommodate mixed-voltage signal and power distribution. Its 82-position count supports parallel address/data bus interfaces up to 32 bits wide plus control lines, and the polarized housing ensures reliable field assembly in maintenance-intensive applications. The high-profile post height provides additional mechanical clearance for heat sinks or through-hole components on the mating board.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-141-04-H-DV-P-TR datasheet?
TSM-141-04-H-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-141-04-H-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the H (high-profile) designation mean for the TSM-141-04-H-DV-P-TR stack height?
The H designation specifies a high-profile post height, which is taller than the standard or low-profile variants and typically provides a board-to-board separation of approximately 8.5 mm or more. This additional clearance accommodates heat sinks, bypass capacitors, or tall surface-mount components on the mating daughter board, making the TSM-141-04-H-DV-P-TR preferable over lower-profile options in thermally constrained 82-position bus interconnect designs.
How does the polarization feature of TSM-141-04-H-DV-P-TR prevent incorrect board insertion?
The -P polarization feature introduces an asymmetric key in the 82-position dual-row housing that prevents the mating board from seating unless oriented correctly. Without polarization, a dual-row 0.100" pitch connector at 82 positions could accidentally be inserted 180° rotated, applying up to 250 V across reversed signal or power pins. The mechanical key eliminates this failure mode in field service scenarios where boards may be replaced by technicians without schematics on hand.
What pitch and total contact count does the TSM-141-04-H-DV-P-TR provide?
The TSM-141-04-H-DV-P-TR has 82 total positions in a dual-row layout at a 0.100" (2.54 mm) pitch, providing 41 contacts per row. This configuration supports up to 41 differential pairs or 82 single-ended signals with contact resistance below 20 mΩ per pin, suitable for parallel bus architectures in industrial controllers, PLC expansion modules, and embedded computing backplanes operating at standard 3.3 V, 5 V, or 12 V rail voltages.
When would a designer choose TSM-141-04-H-DV-P-TR over a lower-pin-count connector in a backplane design?
Designers select the TSM-141-04-H-DV-P-TR when a backplane slot must carry 32-bit or wider parallel address and data buses plus control signals through a single 82-position connector rather than two smaller connectors. Consolidating to one 82-pin connector reduces PCB routing complexity by eliminating the 3 mm gap between two smaller connectors, saving approximately 5 mm of backplane real estate per slot, and reducing the connector bill of materials from 2 parts to 1 per card slot.
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