TSM-141-03-L-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-141-03-L-DV-P-TR is an 82-position dual-row surface-mount terminal strip with 0.100-inch (2.54 mm) pitch, featuring right-angle leads and tape-and-reel packaging optimized for high-volume automated PCB assembly. From $2.60, in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- TSM-141-03-L-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-141-03-L-DV-P-TR?
- 82-position dual-row layout on 0.100-inch (2.54 mm) pitch providing 41 signal pairs on a standard 2.54 mm grid
- Right-angle (L) lead orientation enabling edge-mount PCB connections with horizontal mating access for panel enclosures
- Tape-and-reel (TR) packaging supporting automated SMT pick-and-place at rates above 3,000 parts/hour
- Surface-mount termination rated for standard 260°C reflow solder profiles ensuring reliable joint quality
What is TSM-141-03-L-DV-P-TR used for?
The TSM-141-03-L-DV-P-TR is designed for edge-mount surface-mount applications in industrial control systems, embedded computing backplanes, and rack-mount enclosures where horizontal mating access is required. Its 82-position dual-row footprint at 2.54 mm pitch routes 41 signal pairs along approximately 102.87 mm of PCB edge, providing a reliable high-I/O interface in a standard grid format. The tape-and-reel packaging ensures consistent automated assembly in lean SMT production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-141-03-L-DV-P-TR datasheet?
TSM-141-03-L-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-141-03-L-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin count and pitch of the TSM-141-03-L-DV-P-TR, and how does the right-angle orientation help in enclosure designs?
The TSM-141-03-L-DV-P-TR features 82 positions in 2 rows of 41 on a 0.100-inch (2.54 mm) pitch, with right-angle (L) leads that orient the mating interface perpendicular to the PCB surface. This allows the connector to be accessed from the side of the board — essential in panel-mount enclosures with vertical clearance under 15 mm where a vertical-entry connector cannot be mated without removing the PCB.
How does the TSM-141-03-L-DV-P-TR support high-volume automated assembly, and what placement accuracy is achievable?
The TSM-141-03-L-DV-P-TR's tape-and-reel (TR) packaging enables automated SMT pick-and-place machines to handle the 82-position connector at rates above 3,000 placements per hour with positional tolerances within ±0.1 mm. After placement, the SMT leads are reflowed using a standard 260°C peak temperature profile, yielding consistent solder joints across the 82 contacts without manual intervention and reducing per-board assembly cost in production volumes over 5,000 units.
For which industrial and embedded applications is the TSM-141-03-L-DV-P-TR a suitable interconnect solution?
The TSM-141-03-L-DV-P-TR suits backplane-to-daughter-card interconnect in industrial PLCs, distributed I/O modules, and multi-axis motion control platforms requiring 41 signal pairs at a 2.54 mm pitch. The connector handles operating temperatures from -40°C to 105°C and provides reliable mating over at least 100 cycles, ensuring long-term performance in factory-floor and process-control environments subject to continuous thermal cycling.
How does the 82-position TSM-141-03-L-DV-P-TR differ from the 80-position TSM-140-05-L-DV-P-TR, and when should each be chosen?
The TSM-141-03-L-DV-P-TR provides 82 positions (41 pairs) versus 80 positions (40 pairs) in the TSM-140-05-L-DV-P-TR, adding 1 extra signal pair per row and extending the PCB footprint by approximately 2.54 mm to about 102.87 mm. Designers should choose the 82-position variant when their signal count is exactly 41 pairs, avoiding unconnected pins that can introduce crosstalk stubs at frequencies above 100 MHz on a densely routed backplane.
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