TSM-141-03-G-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-141-03-G-DV-P-TR is an 82-position dual-row surface mount terminal strip with 2.54mm (0.100") pitch, gold-plated contacts, and tape-and-reel packaging. Provides high-density reliable SMT board interconnection for demanding electronics applications. Available worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- TSM-141-03-G-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-141-03-G-DV-P-TR?
- 82-position dual-row SMT terminal strip with 2.54mm pitch for maximum contact density in a compact PCB footprint
- Gold-plated (-G) contacts ensuring low contact resistance and reliable signal integrity across the 82-position interface
- Tape-and-reel (-TR) packaging for seamless integration into automated high-volume SMT pick-and-place production
What is TSM-141-03-G-DV-P-TR used for?
The TSM-141-03-G-DV-P-TR is used in high-density board-to-board interconnect applications including FPGA evaluation boards, communication modules, and industrial computing systems requiring 82-position dual-row connectivity with gold contact reliability. Its 2.54mm pitch surface mount design suits test and measurement equipment and embedded computing platforms where stable, low-resistance signal paths across 82 contacts are essential. The gold-plated contacts and tape-and-reel packaging make this connector equally suited for laboratory prototyping and high-volume production assemblies.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-141-03-G-DV-P-TR datasheet?
TSM-141-03-G-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-141-03-G-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact finish of the TSM-141-03-G-DV-P-TR and why does it matter for signal integrity?
The -G designation indicates gold-plated contacts on the TSM-141-03-G-DV-P-TR. Gold plating minimizes contact resistance and oxidation across the 82-position dual-row interface, ensuring reliable signal integrity in applications requiring low insertion loss and stable low-milliohm contact resistance over extended service life.
How does the 82-position dual-row layout of the TSM-141-03-G-DV-P-TR compare to smaller SAMTEC TSM variants?
With 82 positions arranged in 2 rows at 2.54mm pitch, the TSM-141-03-G-DV-P-TR provides more contact positions than the 78-position TSM-139 series while sharing the same SMT footprint concept. This makes it ideal for FPGA and communications boards needing more than 78 signals in a single connector with gold-contact reliability.
In which production environments is the tape-and-reel TSM-141-03-G-DV-P-TR most advantageous?
The -TR tape-and-reel packaging enables the TSM-141-03-G-DV-P-TR to be loaded directly into SMT pick-and-place feeders for automated reflow assembly. High-volume manufacturing of industrial controllers, server boards, and communications modules with 82-position dual-row SMT connector requirements benefit most from this packaging format.
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