TSM-140-05-G-DV-P-TR SAMTEC Connector (Other) In Stock
The Samtec TSM-140-05-G-DV-P-TR is an 80-position dual-row 2.54 mm pitch surface-mount terminal strip with gold-plated contacts and a tape-and-reel packaging for automated assembly. It features a 0.100 inch grid spacing, dual-row layout, and is rated for reliable signal interconnection in board-to-board and cable-to-board applications. Available from stock worldwide with standard lead-free construction.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Datasheet
- TSM-140-05-G-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-140-05-G-DV-P-TR?
- 80 positions in a dual-row 2.54 mm (0.100 inch) pitch layout for high-density surface-mount interconnection
- Gold-plated contacts for low contact resistance and reliable mating in demanding signal and power applications
- Tape-and-reel (TR) packaging optimized for high-volume pick-and-place automated PCB assembly
- Surface-mount termination compatible with standard reflow soldering profiles
What is TSM-140-05-G-DV-P-TR used for?
The TSM-140-05-G-DV-P-TR is well suited for board-to-board and wire-to-board interconnection on computing, industrial, and test-equipment PCBs where a high-pin-count 2.54 mm pitch header is required. Its 80 positions and dual-row arrangement allow compact routing of data buses, power rails, and control signals in a single connector footprint. The tape-and-reel format supports seamless integration into high-volume automated assembly lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-140-05-G-DV-P-TR datasheet?
TSM-140-05-G-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-140-05-G-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the TSM-140-05-G-DV-P-TR provide, and what is its pitch?
The TSM-140-05-G-DV-P-TR provides 80 positions arranged in 2 rows at a 2.54 mm (0.100 inch) pitch. This dual-row configuration allows routing of 40 signals per row, making it suitable for parallel data buses, mixed signal-and-power headers, or backplane edge connectors where a compact footprint is important.
Is TSM-140-05-G-DV-P-TR compatible with automated SMT assembly, and what reel packaging is used?
Yes. The TSM-140-05-G-DV-P-TR uses tape-and-reel (TR) packaging compatible with standard pick-and-place equipment. The surface-mount termination is designed for standard reflow soldering profiles up to 260 °C peak, allowing the connector to be placed and soldered alongside other SMT components in a single pass through the reflow oven.
What contact plating does the TSM-140-05-G-DV-P-TR use and why does it matter for signal integrity?
The TSM-140-05-G-DV-P-TR uses gold-plated contacts (G designation in the part number), typically 15 µin to 30 µin of gold over nickel underplate. Gold plating provides low and stable contact resistance across the 80 positions, resists oxidation in humid environments, and ensures reliable mating in low-signal-level applications such as LVDS or SPI buses where milliohm-level contact resistance is required.
Which alternative Samtec connector families could replace TSM-140-05-G-DV-P-TR in a redesign with tighter spacing?
For a tighter pitch, Samtec's HSMC or SFML series at 1.27 mm pitch offer higher density with similar dual-row surface-mount geometry. If through-hole termination is preferred instead of SMT, the TSW series at the same 2.54 mm pitch with 80 positions provides a drop-in dimensional alternative. Each alternative changes the mating connector requirement, so the mating side must be verified for compatibility before substitution.
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