TSM-140-04-L-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-140-04-L-DV-P-TR is an 80-position, dual-row surface-mount terminal strip with 0.100" (2.54 mm) pitch and tape-and-reel packaging for automated assembly. It provides reliable signal and power interconnection on standard 0.100" grid PCB layouts. In-stock units available worldwide with fast international shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Datasheet
- TSM-140-04-L-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 80-position dual-row configuration at 0.100" (2.54 mm) pitch for compatibility with standard through-hole footprint layouts in SMT form
- Tape-and-reel (-TR) packaging supports high-speed pick-and-place assembly for volume production runs
- Low-profile surface-mount termination eliminates through-hole drilling, reducing PCB fabrication cost and assembly time
- Dual-row DV variant offers increased contact density for power and mixed-signal applications on compact boards
Applications
The TSM-140-04-L-DV-P-TR is used in industrial control boards, data acquisition modules, and embedded computing platforms requiring 80 surface-mount signal or power connections on a standard 0.100" grid. The tape-and-reel format suits high-volume SMT production lines, while the dual-row dual-voltage (DV) layout supports mixed-signal board designs. It is also common in test-and-measurement daughter cards where large pin counts and reliable solder joints are priorities.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the TSM-140-04-L-DV-P-TR terminal strip provide?
The TSM-140-04-L-DV-P-TR provides 80 positions arranged in 2 rows of 40 at a 0.100" (2.54 mm) pitch. This dual-row layout is compatible with standard 0.100" grid PCB footprints, making it straightforward to migrate from through-hole to surface-mount designs while retaining the same board outline and connector placement.
Which production line setup benefits from the tape-and-reel (-TR) packaging of this SAMTEC terminal strip?
Automated SMT pick-and-place lines benefit directly from the tape-and-reel format, which feeds components at a consistent orientation and pitch to placement heads operating at rates above 10,000 components per hour. This eliminates manual handling of loose connector strips, reducing placement error rates and speeding up production throughput on high-volume industrial PCB assemblies with 80-pin surface-mount connectors.
When is the TSM-140-04-L-DV-P-TR preferred over a through-hole version of the same connector?
The surface-mount TSM variant is preferred when PCB fabrication uses a no-drill or minimal-drill process, as the SMT termination eliminates 80 through-holes and the associated plating and drilling costs. It also allows placement on the bottom side of the board, enabling denser two-sided layouts. At a 0.100" pitch with 80 contacts, the SMT joint profile adds less than 1 mm of stand-off height compared to through-hole alternatives.
What solder reflow conditions are compatible with the TSM-140-04-L-DV-P-TR?
The TSM-140-04-L-DV-P-TR is designed for standard lead-free reflow profiles with a 260°C peak temperature, consistent with IPC/JEDEC J-STD-020 classification. The 0.100" (2.54 mm) pitch pads allow adequate solder paste volume per joint, supporting a reliable fillet with no bridging risk during reflow. SAMTEC terminal strips are rated for at least 2 reflow cycles without loss of solder joint integrity.
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