TSM-140-03-SM-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-140-03-SM-DV-P-TR is an 80-position dual-row 0.100" pitch surface mount terminal strip in tape-and-reel packaging, engineered for automated SMT assembly in development boards, backplanes, and I/O expansion headers. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Datasheet
- TSM-140-03-SM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-140-03-SM-DV-P-TR?
- 80-position dual-row layout at 0.100" (2.54 mm) pitch provides high pin-count connectivity on standard 0.1" grid PCB designs
- Tape-and-reel (-TR) packaging enables high-throughput automated SMT pick-and-place assembly for volume production
- Surface mount termination eliminates through-hole drilling of 80 positions, reducing PCB fabrication cost and layer count constraints
What is TSM-140-03-SM-DV-P-TR used for?
The TSM-140-03-SM-DV-P-TR serves as an 80-pin expansion header in single-board computers, FPGA development kits, and industrial controller backplanes where 0.100" pitch dual-row connectivity is the standard. Its SMT footprint and tape-and-reel packaging streamline automated board assembly for products requiring reliable 80-position dual-row terminal strip connections in volume manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-140-03-SM-DV-P-TR datasheet?
TSM-140-03-SM-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-140-03-SM-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the TSM-140-03-SM-DV-P-TR differ from the TSM-140-04-G-DV-P-TR variant?
Both the TSM-140-03-SM-DV-P-TR and TSM-140-04-G-DV-P-TR are 80-position dual-row 0.100" pitch surface mount terminal strips in tape-and-reel format, but they differ in contact finish and row height options specified by the -03 and -04 designators. Engineers should consult the SAMTEC TSM series datasheet to confirm which specific height or plating variant meets the mating height and contact resistance requirements of their 80-pin board design.
What is the mating pitch and total pin count of the TSM-140-03-SM-DV-P-TR?
The TSM-140-03-SM-DV-P-TR provides 80 total positions arranged as 2 rows of 40 contacts at 0.100" (2.54 mm) pitch. This dual-row 80-pin configuration is one of the most widely used expansion header formats in embedded development boards and single-board computers, enabling connection of GPIO, SPI, I2C, UART, and power pins across a compact 0.1" grid footprint.
In which embedded computing platforms is the TSM-140-03-SM-DV-P-TR commonly used?
This 80-position 0.100" dual-row surface mount header is commonly found on FPGA evaluation boards, Raspberry Pi-compatible expansion boards, and industrial PLC I/O modules. Its 80-pin dual-row 0.100" pitch layout is compatible with standard 40x2 header mating sockets used across many embedded Linux platforms, making it a versatile choice for modular hardware design.
Can the TSM-140-03-SM-DV-P-TR be used in a prototype where mating connectors may be inserted and removed frequently?
The TSM-140-03-SM-DV-P-TR is designed for reliable mating in board-to-board and wire-to-board applications, with contact geometry rated for multiple insertion cycles at 0.100" pitch. While specific cycle counts depend on mating contact material, SAMTEC's TSM series is engineered for consistent performance across the expected insertion lifetime of development boards and reconfigurable I/O expansion systems.
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