TSM-140-02-H-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-140-02-H-DV-P-TR is an 80-position dual-row surface-mount terminal strip with 0.100" (2.54 mm) pitch, tall H height, dual-voltage option, and tape-and-reel packaging. Suitable for high-density board-to-board and wire-to-board interconnects in industrial and embedded computing applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Datasheet
- TSM-140-02-H-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-140-02-H-DV-P-TR?
- 80-position dual-row layout at 0.100" (2.54 mm) pitch enables high pin-count surface-mount interconnects on standard 0.1" grid PCBs
- Tall H height profile accommodates stacked board designs with increased board-to-board clearance for components mounted between mating PCBs
- Tape-and-reel (TR) packaging with dual-voltage (DV) option supports automated SMT assembly on high-volume production lines handling mixed signal and power interfaces
What is TSM-140-02-H-DV-P-TR used for?
The TSM-140-02-H-DV-P-TR is deployed in embedded controller boards, industrial backplane connectors, and stacked PCB assemblies requiring 80 signals at the standard 0.100" pitch with increased inter-board clearance. Its dual-voltage capability allows simultaneous routing of logic-level and power supply signals through the same 80-pin connector. Tape-and-reel packaging enables efficient high-volume automated assembly for industrial electronics and computing module production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-140-02-H-DV-P-TR datasheet?
TSM-140-02-H-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-140-02-H-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What height profile does the H option provide in the TSM-140-02-H-DV-P-TR connector?
The H (tall height) option in TSM-140-02-H-DV-P-TR provides a taller board-to-board stack height compared to standard-height TSM variants, creating additional clearance between mated PCBs. This extra vertical space—typically several millimeters above the standard 8.5 mm mated height—accommodates through-hole components, heat sinks, or passive components mounted on the carrier board surface between the two mated boards.
How does the dual-voltage (DV) feature of TSM-140-02-H-DV-P-TR benefit mixed-signal board designs?
The DV (dual-voltage) option in TSM-140-02-H-DV-P-TR allows the 80-position connector to route both low-voltage logic signals (such as 1.8 V or 3.3 V) and higher-voltage power rails (such as 5 V or 12 V) through segregated contact sections within the same connector body. This eliminates the need for separate power and signal connectors, reducing BOM complexity and PCB area on mixed-signal industrial controller boards.
For which stacked PCB architectures is TSM-140-02-H-DV-P-TR most appropriate?
TSM-140-02-H-DV-P-TR is most appropriate for 2-board stacked PCB assemblies where a processor module or I/O expansion board mounts on top of a carrier board using 80-pin dual-row 0.100" connectors. The tall H profile suits designs where electrolytic capacitors, inductors, or through-hole connectors occupy the carrier board surface beneath the stacked module, requiring 10 mm or more of inter-board clearance.
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