TSM-140-01-T-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-140-01-T-DV-P-TR is an 80-position dual-row surface mount terminal strip at 0.100-inch pitch, designed for reliable board-to-board and wire-to-board interconnect. Features dual-in-line pin layout for robust PCB mounting. Available from distributor stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Datasheet
- TSM-140-01-T-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-140-01-T-DV-P-TR?
- 80-position dual-row 0.100-inch pitch terminal strip with surface mount tails enabling high-density through-board interconnect in standard DIP-compatible footprints
- Dual-voltage (DV) contact design supporting both through-hole and SMT board interface flexibility in mixed-technology PCB assemblies
- Tape-and-reel packaging (TR) for automated pick-and-place assembly in high-volume PCB manufacturing with consistent component orientation
What is TSM-140-01-T-DV-P-TR used for?
The TSM-140-01-T-DV-P-TR is used in high pin-count dual-row interconnect applications where 0.100-inch pitch provides robust mechanical engagement and compatibility with standard DIP-grid PCB routing. It is well-suited for backplane expansion cards, industrial I/O modules, and legacy equipment interfaces requiring reliable 80-pin surface mount terminal strips. Tape-and-reel packaging makes this part efficient for automated assembly lines in medium- to high-volume production runs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-140-01-T-DV-P-TR datasheet?
TSM-140-01-T-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-140-01-T-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin pitch and row count of the TSM-140-01-T-DV-P-TR, and how does this affect compatibility with standard PCB grid layouts?
The TSM-140-01-T-DV-P-TR uses a 0.100-inch (2.54 mm) pitch in a dual-row configuration with 80 total positions, providing 40 positions per row. This pitch is fully compatible with standard 100-mil grid PCB layouts used in legacy DIP-style designs, making it straightforward to route on 2-layer PCBs without requiring fine-pitch inner-layer routing. The 80-position count spans approximately 2.0 inches of board length along the connector axis.
What does the DV designation in TSM-140-01-T-DV-P-TR mean, and in what assembly scenarios is it beneficial?
The DV designation in the SAMTEC TSM series indicates a dual-voltage or dual-entry contact configuration that allows the terminal strip to interface with both surface mount pads and through-board connections on certain board-to-board configurations. This is beneficial in mixed-technology assemblies where one PCB uses through-hole and the mating card uses surface mount pads, enabling a single connector family to bridge both technologies with contact forces typically in the 50 grams to 150 grams per pin range.
How does the TSM-140-01-T-DV-P-TR's tape-and-reel packaging affect procurement planning for automated SMT lines?
The TR (tape-and-reel) packaging of the TSM-140-01-T-DV-P-TR ensures consistent component orientation for automated pick-and-place machines, reducing placement errors in SMT assembly. Standard reels typically contain 500 to 1000 units, which aids production planning by aligning order quantities to full-reel increments. For assembly lines running at 3000 to 5000 placements per hour, tape-and-reel avoids the manual component loading downtime associated with tray or bulk packaging formats.
When should TSM-140-01-T-DV-P-TR be chosen over SAMTEC's finer-pitch SFM series for a new high pin-count design?
Choose the TSM-140-01-T-DV-P-TR when the PCB uses a standard 100-mil routing grid, signal currents per contact exceed 500 mA, or the design needs compatibility with 0.100-inch pitch mating connectors in existing systems. The SFM series at 0.050-inch pitch is preferred when PCB area is the primary constraint and signal currents are below 500 mA per pin. The TSM's larger 0.100-inch pitch also provides better mechanical robustness and easier manual soldering inspection compared to the finer 0.050-inch SFM pitch.
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