TSM-140-01-T-DV-P-TR SAMTEC Connector (Other) In Stock

Name: TSM-140-01-T-DV-P-TR
Brand: SAMTEC
SKU: TSM-140-01-T-DV-P-TR
Availability: InStock

SAMTEC TSM-140-01-T-DV-P-TR is an 80-position dual-row surface mount terminal strip at 0.100-inch pitch, designed for reliable board-to-board and wire-to-board interconnect. Features dual-in-line pin layout for robust PCB mounting. Available from distributor stock with worldwide shipping.

ACTIVEConnectorVerified Jun 2026

Package / Visual Reference

TSM-140-01-T-DV-P-TROther

Quick Facts

Manufacturer: SAMTEC
Package: Other
Pin Count: 80
Lifecycle: ACTIVE
Datasheet: TSM-140-01-T-DV-P-TR Datasheet PDF
Category: Connector
RoHS: Compliant
Lead Time: 3–7 business days
Shipping: DHL Express · Worldwide

What are the key features of TSM-140-01-T-DV-P-TR?

80-position dual-row 0.100-inch pitch terminal strip with surface mount tails enabling high-density through-board interconnect in standard DIP-compatible footprints
Dual-voltage (DV) contact design supporting both through-hole and SMT board interface flexibility in mixed-technology PCB assemblies
Tape-and-reel packaging (TR) for automated pick-and-place assembly in high-volume PCB manufacturing with consistent component orientation

What is TSM-140-01-T-DV-P-TR used for?

The TSM-140-01-T-DV-P-TR is used in high pin-count dual-row interconnect applications where 0.100-inch pitch provides robust mechanical engagement and compatibility with standard DIP-grid PCB routing. It is well-suited for backplane expansion cards, industrial I/O modules, and legacy equipment interfaces requiring reliable 80-pin surface mount terminal strips. Tape-and-reel packaging makes this part efficient for automated assembly lines in medium- to high-volume production runs.

Compliance & Regulatory

RoHS Status	Compliant
Lead-Free	Yes (Pb-Free)

Where can I find the TSM-140-01-T-DV-P-TR datasheet?

TSM-140-01-T-DV-P-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for TSM-140-01-T-DV-P-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the pin pitch and row count of the TSM-140-01-T-DV-P-TR, and how does this affect compatibility with standard PCB grid layouts?

The TSM-140-01-T-DV-P-TR uses a 0.100-inch (2.54 mm) pitch in a dual-row configuration with 80 total positions, providing 40 positions per row. This pitch is fully compatible with standard 100-mil grid PCB layouts used in legacy DIP-style designs, making it straightforward to route on 2-layer PCBs without requiring fine-pitch inner-layer routing. The 80-position count spans approximately 2.0 inches of board length along the connector axis.

What does the DV designation in TSM-140-01-T-DV-P-TR mean, and in what assembly scenarios is it beneficial?

The DV designation in the SAMTEC TSM series indicates a dual-voltage or dual-entry contact configuration that allows the terminal strip to interface with both surface mount pads and through-board connections on certain board-to-board configurations. This is beneficial in mixed-technology assemblies where one PCB uses through-hole and the mating card uses surface mount pads, enabling a single connector family to bridge both technologies with contact forces typically in the 50 grams to 150 grams per pin range.

How does the TSM-140-01-T-DV-P-TR's tape-and-reel packaging affect procurement planning for automated SMT lines?

The TR (tape-and-reel) packaging of the TSM-140-01-T-DV-P-TR ensures consistent component orientation for automated pick-and-place machines, reducing placement errors in SMT assembly. Standard reels typically contain 500 to 1000 units, which aids production planning by aligning order quantities to full-reel increments. For assembly lines running at 3000 to 5000 placements per hour, tape-and-reel avoids the manual component loading downtime associated with tray or bulk packaging formats.

When should TSM-140-01-T-DV-P-TR be chosen over SAMTEC's finer-pitch SFM series for a new high pin-count design?

Choose the TSM-140-01-T-DV-P-TR when the PCB uses a standard 100-mil routing grid, signal currents per contact exceed 500 mA, or the design needs compatibility with 0.100-inch pitch mating connectors in existing systems. The SFM series at 0.050-inch pitch is preferred when PCB area is the primary constraint and signal currents are below 500 mA per pin. The TSM's larger 0.100-inch pitch also provides better mechanical robustness and easier manual soldering inspection compared to the finer 0.050-inch SFM pitch.

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Lead Time3-7 business days

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TSM-140-01-T-DV-P-TR SAMTEC Connector (Other) In Stock

What are the key features of TSM-140-01-T-DV-P-TR?

What is TSM-140-01-T-DV-P-TR used for?

Compliance & Regulatory

Where can I find the TSM-140-01-T-DV-P-TR datasheet?

What are equivalent replacements for TSM-140-01-T-DV-P-TR?

Frequently Asked Questions

What is the pin pitch and row count of the TSM-140-01-T-DV-P-TR, and how does this affect compatibility with standard PCB grid layouts?

What does the DV designation in TSM-140-01-T-DV-P-TR mean, and in what assembly scenarios is it beneficial?

How does the TSM-140-01-T-DV-P-TR's tape-and-reel packaging affect procurement planning for automated SMT lines?

When should TSM-140-01-T-DV-P-TR be chosen over SAMTEC's finer-pitch SFM series for a new high pin-count design?

Related Guides

CSD87313DMS Synchronous Buck Power Stage Design Guide

STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection

C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC

STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security

Why Buy from FindMyChip

About SAMTEC

More from SAMTEC

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