TSM-139-05-H-DV-P-TR SAMTEC Connector (Other) In Stock
The TSM-139-05-H-DV-P-TR is a 78-position dual-row surface-mount terminal strip from SAMTEC with a 2.54mm (0.100") pitch, designed for reliable board-to-board and PCB edge interconnects. It provides 78 pins in a dual-row configuration with press-fit retention for automated SMT assembly. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TSM-139-05-H-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-139-05-H-DV-P-TR?
- 78-position dual-row layout on 2.54mm (0.100") pitch delivering high pin density in a compact surface-mount footprint
- Press-fit and surface-mount termination enabling reliable automated PCB assembly in high-volume production environments
- Tape-and-reel (TR) packaging compatible with standard pick-and-place machines for repeatable SMT placement accuracy
What is TSM-139-05-H-DV-P-TR used for?
The TSM-139-05-H-DV-P-TR is used in backplane interconnects, daughter-card interfaces, and modular PCB systems where 78 signals must be routed across a board-to-board boundary on a standard 2.54mm grid. Its dual-row surface-mount design suits dense digital backplanes, test fixture headers, and FPGA daughter cards requiring many I/O connections in a small footprint. The tape-and-reel packaging format supports high-volume automated assembly in industrial electronics and communication equipment manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-139-05-H-DV-P-TR datasheet?
TSM-139-05-H-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-139-05-H-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many pins does the TSM-139-05-H-DV-P-TR provide, and are they arranged in a dual-row configuration?
The TSM-139-05-H-DV-P-TR provides 78 pins total in a dual-row configuration on a 2.54mm (0.100") pitch, meaning 39 pins per row, which is sufficient for parallel data buses, control signals, and power rails in a single compact surface-mount connector strip.
Is the TSM-139-05-H-DV-P-TR compatible with automated SMT assembly, and does the tape-and-reel packaging help?
Yes, the TR suffix confirms tape-and-reel packaging on standard carrier tape, allowing the TSM-139-05-H-DV-P-TR to be fed directly into pick-and-place machines for high-volume SMT assembly, with the surface-mount termination style ensuring consistent 2.54mm pitch pad alignment on the PCB.
What board interconnect scenarios benefit most from the 78-position dual-row layout of the TSM-139-05-H-DV-P-TR?
Backplane-to-daughter-card connections, FPGA mezzanine boards, and test fixture headers that need to route 70 or more signals across a PCB boundary benefit from the 78-position format, as it avoids the need for multiple smaller connectors and maintains signal routing on a standard 2.54mm grid.
What pitch does the TSM-139-05-H-DV-P-TR use, and is it backward compatible with standard 0.100" header systems?
The TSM-139-05-H-DV-P-TR uses a 2.54mm (0.100") pin pitch, which is the industry-standard pitch shared by most 0.100" through-hole and surface-mount headers, making it backward compatible with mating connectors, IDC cables, and socket strips from multiple manufacturers using that pitch.
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