TSM-139-05-F-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-139-05-F-DV-P-TR is a 78-position dual-row surface mount terminal strip with 2.54mm (0.100") pitch. Offers reliable SMT board-to-board connectivity in a compact footprint with tape-and-reel packaging. Available worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TSM-139-05-F-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-139-05-F-DV-P-TR?
- 78-position dual-row SMT terminal strip with 2.54mm (0.100 inch) pitch for high-density board interconnection
- Tape-and-reel (-TR) packaging enabling high-volume automated pick-and-place SMT assembly
- Dual-row (-DV) configuration providing double the contact density versus single-row alternatives in the same PCB footprint
What is TSM-139-05-F-DV-P-TR used for?
The TSM-139-05-F-DV-P-TR is used in high-density PCB interconnect applications including FPGA development boards, test and measurement equipment, and embedded computing modules requiring 78-position dual-row connectivity. Its 2.54mm pitch surface mount design suits industrial control systems and telecommunications equipment where reliable, compact board-to-board connections are essential. This terminal strip is ideal for prototyping platforms and production assemblies demanding high contact counts with SMT compatibility.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-139-05-F-DV-P-TR datasheet?
TSM-139-05-F-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-139-05-F-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SAMTEC TSM-139-05-F-DV-P-TR terminal strip have and what is its pitch?
The TSM-139-05-F-DV-P-TR features 78 positions arranged in a dual-row configuration with 2.54mm (0.100 inch) pitch, providing high-density connectivity while maintaining compatibility with standard 0.100-inch grid PCB layouts.
Can the TSM-139-05-F-DV-P-TR be assembled using automated SMT pick-and-place equipment?
Yes, the -TR suffix indicates tape-and-reel packaging specifically designed for automated SMT pick-and-place assembly. The surface mount footprint supports reflow soldering processes used in high-volume manufacturing of PCBs with 78-position connector requirements.
For which board interconnect applications is the dual-row TSM-139-05-F-DV-P-TR most appropriate?
This 78-position dual-row SMT terminal strip suits FPGA evaluation boards, backplane interconnects, and embedded computing modules where dense board-to-board signaling is needed. The dual-row layout provides 78 contacts in a compact area following the 2.54mm pitch grid standard.
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