TSM-139-04-TM-DV-P-TR SAMTEC Connector (Other) In Stock
Samtec TSM-139-04-TM-DV-P-TR is a 78-position dual-row surface mount terminal strip with 0.100" pitch and tape-and-reel packaging for automated assembly. Gold-plated contacts provide reliable mating in industrial and computing applications. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TSM-139-04-TM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-139-04-TM-DV-P-TR?
- 78-position dual-row configuration at 0.100" (2.54 mm) pitch supporting high-density board-to-board signal routing
- Tape-and-reel (TR) packaging enabling automated pick-and-place assembly for high-volume PCB production
- Surface mount termination compatible with standard lead-free reflow soldering processes up to 260°C
What is TSM-139-04-TM-DV-P-TR used for?
The TSM-139-04-TM-DV-P-TR suits high-volume automated PCB assembly for industrial control modules, embedded computing platforms, and telecom line cards requiring 78-pin dual-row connectivity at 0.100" pitch. Tape-and-reel packaging supports continuous feeder operation in SMT production lines, minimizing handling overhead in large-scale manufacturing environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-139-04-TM-DV-P-TR datasheet?
TSM-139-04-TM-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-139-04-TM-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the tape-and-reel packaging of TSM-139-04-TM-DV-P-TR benefit high-volume PCB manufacturing?
The tape-and-reel (TR) suffix indicates that the TSM-139-04-TM-DV-P-TR is packaged on continuous carrier tape compatible with standard SMT pick-and-place feeders. This eliminates manual placement of 78-position connectors, enables placement speeds exceeding 5,000 components per hour on modern SMT lines, and reduces orientation errors that commonly occur during hand loading.
Which embedded computing or industrial backplane applications are well suited for the TSM-139-04-TM-DV-P-TR?
The 78-position dual-row layout at 0.100" pitch accommodates mixed power-and-signal buses found in CompactPCI, VMEbus, and custom industrial backplane designs. A single TSM-139-04-TM-DV-P-TR can carry 72 signal lines plus 6 power/ground contacts, enabling full parallel data bus interfaces for 8-bit to 32-bit processor boards without requiring multiple connectors.
How does TSM-139-04-TM-DV-P-TR differ from TSM-139-01-TL-DV-P-TR in terms of assembly suitability?
The TSM-139-04-TM-DV-P-TR uses tape-and-reel packaging and a TM (top-mount) orientation, optimizing it for automated SMT feeder assembly, whereas TSM-139-01-TL-DV-P-TR uses a TL configuration suited for different board edge orientations. Both carry 78 positions at 0.100" pitch, but production runs above 500 units per week favor the TR-packaged variant for feeder efficiency.
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