TSM-139-04-FM-DV-P-TR SAMTEC Connector (Other) In Stock
The SAMTEC TSM-139-04-FM-DV-P-TR is a 78-position dual-row 0.100" pitch surface-mount terminal strip with female machined contacts and tape-and-reel packaging. Available from stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TSM-139-04-FM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-139-04-FM-DV-P-TR?
- 78-position dual-row surface-mount configuration on 0.100" (2.54 mm) pitch for high-density board-to-board or cable-to-board connectivity
- Female machined (FM) contacts deliver superior contact reliability with tighter tolerances and higher cycle life compared to stamped contacts
- Surface-mount termination eliminates through-hole drilling, reducing PCB fabrication cost and enabling double-sided board population
- Tape-and-reel (-TR) packaging supports automated pick-and-place assembly at high production volumes with minimal operator intervention
- Dual-row polarized housing prevents mismating and accommodates both straight and right-angle mating header configurations
What is TSM-139-04-FM-DV-P-TR used for?
The TSM-139-04-FM-DV-P-TR is deployed in industrial computing modules, FPGA development boards, and backplane expansion systems where a high-density 78-pin surface-mount interface is needed for reliable board-to-board signal routing. Its machined female contacts are especially valued in test-and-measurement fixtures and prototype boards that undergo frequent mating cycles without contact wear degradation. The SMT footprint and tape-and-reel format make this connector a strong fit for automated assembly lines producing communication infrastructure cards and embedded computing platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-139-04-FM-DV-P-TR datasheet?
TSM-139-04-FM-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-139-04-FM-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact configuration and pitch does the TSM-139-04-FM-DV-P-TR use for surface-mount assembly?
The TSM-139-04-FM-DV-P-TR provides 78 positions arranged in 2 rows of 39 on a 0.100" (2.54 mm) pitch, using female machined contacts that are reflow-solderable directly to PCB pads. This dual-row SMT layout achieves high pin density while keeping the connector body under 100 mm in length, making it practical for compact embedded computing carrier boards.
How do machined female contacts in the TSM-139-04-FM-DV-P-TR compare to stamped contacts for high-cycle applications?
Machined contacts are turned from solid brass rod stock, yielding contact tolerances within ±0.005 mm and typical insertion forces consistent over 500 or more mating cycles, compared to stamped contacts that can deform after fewer than 100 cycles under repeated insertion. In production test fixtures or hot-swap development boards, this translates to longer service life and more consistent contact resistance below 30 mΩ throughout the connector's operational lifetime.
For an FPGA expansion board design, how does the TSM-139-04-FM-DV-P-TR support high-speed differential signals?
The 0.100" pitch dual-row layout allows designers to assign adjacent pin pairs to differential signals, maintaining controlled impedance routing from the FPGA I/O bank through the connector to a mating header on a daughtercard. At data rates up to 500 MHz per differential pair, the short stub length of the SMT contact minimizes signal degradation and return loss, provided the PCB stack-up maintains 100 Ω differential impedance at the connector landing pads.
What are the key procurement advantages of ordering the TSM-139-04-FM-DV-P-TR in tape-and-reel format?
The -TR suffix designates tape-and-reel packaging on reels holding typically 250 to 1000 parts depending on connector size, compatible with standard SMT feeder widths. For production runs exceeding 500 boards, this packaging reduces connector placement cycle time by eliminating manual singulation, lowers the risk of ESD or contamination damage during handling, and simplifies line change-over compared to tray or bulk packaging formats.
When should an engineer choose the TSM-139-04-FM-DV-P-TR over a through-hole equivalent for a backplane design?
A surface-mount TSM connector eliminates the need for 78 plated through-holes on a backplane PCB, freeing inner routing layers for high-speed differential pairs and power planes and reducing fabrication cost on 8-layer or denser stackups. Through-hole connectors are preferred only when the connector must withstand axial pull forces exceeding 5 N per pin or when wave-soldering is the sole assembly process available, conditions uncommon in modern SMT-primary backplane manufacturing.
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