TSM-139-03-T-DV-P-TR SAMTEC Connector (Other) In Stock
The TSM-139-03-T-DV-P-TR is a 78-position dual-row surface-mount terminal strip from SAMTEC with 0.100 inch (2.54 mm) pitch for high-density PCB signal interconnects. It supports standard 0.100 inch grid layouts with tape-and-reel packaging for automated SMT assembly. Available in stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TSM-139-03-T-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-139-03-T-DV-P-TR?
- 78-position dual-row configuration on 0.100 inch (2.54 mm) pitch provides high contact density on a standard grid for backplane and daughter card interfaces
- Surface-mount termination with tape-and-reel (-TR) packaging enables automated pick-and-place assembly for high-volume SMT production
- Dual-row layout accommodates simultaneous signal and power routing in compact PCB designs for embedded computing and instrumentation
What is TSM-139-03-T-DV-P-TR used for?
The TSM-139-03-T-DV-P-TR surface-mount terminal strip is well suited for high-density board-to-board signal interfaces in embedded computing modules, test and measurement instrument backplanes, and industrial I/O expansion cards where a large number of signals must be terminated in a compact 0.100 inch pitch footprint. Its 78-position dual-row layout supports parallel bus architectures, FPGA I/O banks, and multi-channel analog or digital signal routing across mated PCB assemblies. The tape-and-reel format makes it a reliable choice for high-volume SMT production lines in consumer, industrial, and communications electronics.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-139-03-T-DV-P-TR datasheet?
TSM-139-03-T-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-139-03-T-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-139-03-T-DV-P-TR provide and what is its contact pitch?
The TSM-139-03-T-DV-P-TR provides 78 positions in a dual-row configuration on a 0.100 inch (2.54 mm) pitch, the most widely used standard grid for through-hole and SMT headers. The 78-position count supports high-density signal interfaces such as 32-bit parallel buses plus control lines, FPGA I/O bank breakouts, or multi-channel ADC input routing, all within a single surface-mount strip that measures approximately 1.95 inches in length for the 39-per-row dual layout.
What is the advantage of choosing the TSM-139-03-T-DV-P-TR over a through-hole version for automated SMT assembly?
The surface-mount TSM-139-03-T-DV-P-TR eliminates the need for drill holes and wave soldering, allowing full reflow SMT assembly with the rest of the board in a single pass. Combined with tape-and-reel packaging, it enables automated pick-and-place at high speed with consistent placement accuracy across all 78 positions on a 0.100 inch pitch. This reduces assembly cycle time, lowers per-unit cost at volumes above 1000 units, and avoids the additional drill cost for 78 through-hole pins.
Which SAMTEC mating connector families are compatible with the TSM-139-03-T-DV-P-TR for a board-to-board 0.100 inch pitch interface?
The TSM-139-03-T-DV-P-TR is part of SAMTEC's TSM terminal strip series and mates with corresponding TSW or TSMA receptacle strips using the standard 0.100 inch (2.54 mm) pitch dual-row footprint. For a stacking board-to-board application, SAMTEC's SSM or SSW socket strips on the mating board provide a reliable 0.100 inch pitch mate. Designers should confirm the 3.0 mm tail length and dual-row contact centerline dimensions against mating connector datasheets to ensure proper engagement depth and contact wipe.
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