TSM-139-02-T-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-139-02-T-DV-P-TR is a 78-position dual-row surface mount terminal strip with 0.100 inch (2.54 mm) pitch in tape-and-reel packaging for automated PCB assembly. It provides high-density SMT connectivity for board-to-cable or board-to-board applications. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TSM-139-02-T-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-139-02-T-DV-P-TR?
- 78-position dual-row (2×39) layout on 0.100 inch pitch delivers 78 contacts in a single SMT connector for dense signal and power routing
- Surface mount termination eliminates through-hole drilling, reducing PCB fabrication cost and enabling back-side component placement on double-sided boards
- Tape-and-reel (TR) packaging supports automated pick-and-place assembly at high throughput rates for volume PCB production
- Dual-row configuration on 2.54 mm pitch is compatible with standard 0.100 inch mating housings and IDC cable assemblies widely used in industrial and embedded systems
What is TSM-139-02-T-DV-P-TR used for?
The TSM-139-02-T-DV-P-TR is designed for high pin-count board-to-cable and board-to-board interconnects in industrial control systems, embedded computing backplanes, and test and measurement equipment requiring 78-way SMT signal routing. Its dual-row 0.100 inch pitch layout suits backplane edge connectors, logic analyzer probe adapters, and expansion module interfaces in rack-mount industrial instrumentation. The tape-and-reel format enables efficient automated assembly in high-volume PCB production for server management modules, FPGA development boards, and I/O expansion cards.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-139-02-T-DV-P-TR datasheet?
TSM-139-02-T-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-139-02-T-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the TSM-139-02-T-DV-P-TR surface mount terminal strip provide?
The TSM-139-02-T-DV-P-TR offers 78 positions arranged in a 2×39 dual-row layout on a 0.100 inch (2.54 mm) pitch. This high contact count accommodates 78 signal or mixed signal-power lines in a single SMT connector, making it suitable for dense I/O expansion interfaces on industrial controller boards and FPGA evaluation platforms.
What manufacturing advantages does the SMT terminal strip format of the TSM-139-02-T-DV-P-TR offer over through-hole alternatives?
The SMT configuration of the TSM-139-02-T-DV-P-TR eliminates 78 through-holes per connector, reducing PCB drilling and plating costs by approximately 15% to 25% in volume production. SMT placement also enables double-sided PCB assembly and reduces board thickness constraints, which is critical in slim industrial gateway enclosures and compact single-board computers with layer counts of 4 or fewer.
Which industrial or embedded computing designs benefit most from the TSM-139-02-T-DV-P-TR 78-position connector?
The TSM-139-02-T-DV-P-TR is ideal for FPGA development board expansion headers, logic analyzer probe interfaces requiring 64 or more I/O lines, industrial servo drive control panels, and server baseboard management controller (BMC) signal aggregation points. The 78-position count covers full 64-bit data bus plus address and control signals on a single dual-row 0.100 inch connector.
Does the TSM-139-02-T-DV-P-TR support standard IDC cable assembly termination?
Yes, the 0.100 inch (2.54 mm) pitch of the TSM-139-02-T-DV-P-TR is fully compatible with standard 2.54 mm IDC ribbon cable housings, allowing termination of 78-conductor flat cables using mass displacement connectors. This compatibility with off-the-shelf 80-way or custom 78-way IDC cable assemblies reduces harness fabrication cost and simplifies field wiring in industrial rack systems.
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