TSM-139-02-L-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-139-02-L-DV-P-TR is a 78-position dual-row surface mount terminal strip with 2.54 mm pitch, designed for reliable PCB-to-board signal connections in compact electronic assemblies.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TSM-139-02-L-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-139-02-L-DV-P-TR?
- 78-position dual-row configuration with 2.54 mm (0.100") pitch for high-density board connections
- Surface mount termination style enables automated PCB assembly and reflow soldering compatibility
- Tin-plated brass contacts with robust mechanical retention for stable signal integrity in vibration-prone environments
What is TSM-139-02-L-DV-P-TR used for?
The TSM-139-02-L-DV-P-TR is widely used in industrial control boards and embedded computing modules where high pin-count board-to-board interconnects are required. It suits applications such as backplane interconnects, test and measurement equipment, and data acquisition systems demanding reliable 2.54 mm pitch SMT strip connections.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-139-02-L-DV-P-TR datasheet?
TSM-139-02-L-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-139-02-L-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and row configuration of the TSM-139-02-L-DV-P-TR?
The TSM-139-02-L-DV-P-TR features a 2.54 mm (0.100") pitch in a dual-row arrangement, providing 78 total positions. This configuration allows high-density signal routing on a standard PCB footprint while maintaining reliable contact integrity across all 78 pins.
Which PCB assembly processes are compatible with the TSM-139-02-L-DV-P-TR surface mount termination?
This connector uses a surface mount termination style compatible with standard reflow soldering processes at temperatures up to 260°C. Its SMT footprint integrates into automated pick-and-place assembly lines, reducing manual insertion labor for high-volume production of boards with 78-pin interconnect requirements.
When is the TSM-139-02-L-DV-P-TR a suitable alternative to through-hole dual-row strips in industrial control designs?
The TSM-139-02-L-DV-P-TR is preferred over through-hole strips when PCB thickness or component clearance limits wave-soldering access, particularly in assemblies requiring 78 positions at 2.54 mm pitch. Its SMT design reduces board drilling costs and supports double-sided PCB layouts common in industrial control and embedded systems.
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