TSM-139-02-H-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-139-02-H-DV-P-TR is a 78-position dual-row surface mount terminal strip with 2.54mm (0.100") pitch and high-profile contact configuration. Delivers robust SMT board interconnection with tape-and-reel packaging for automated assembly. Available worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TSM-139-02-H-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-139-02-H-DV-P-TR?
- 78-position dual-row SMT terminal strip with high-profile (-H) contacts for secure 2.54mm pitch board mating
- Tape-and-reel (-TR) packaging optimized for automated high-volume pick-and-place SMT manufacturing
- Dual-row (-DV) layout doubles contact density compared to single-row connectors in the same PCB area
What is TSM-139-02-H-DV-P-TR used for?
The TSM-139-02-H-DV-P-TR serves high-density board-to-board interconnect applications in FPGA platforms, industrial controllers, and test and measurement instruments requiring 78-position dual-row connectivity at 2.54mm pitch. Its high-profile contact design provides additional mating stack height, suitable for applications where component clearance above the PCB is required. This surface mount terminal strip supports automated assembly processes, making it well-suited for production-volume manufacturing environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-139-02-H-DV-P-TR datasheet?
TSM-139-02-H-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-139-02-H-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What distinguishes the TSM-139-02-H-DV-P-TR from a standard-profile variant of the same SAMTEC series?
The -H designation in TSM-139-02-H-DV-P-TR indicates a high-profile contact configuration, providing greater mating stack height above the PCB compared to standard-profile variants. This suits enclosures or adjacent component configurations requiring additional clearance at the 2.54mm pitch connector interface with 78 positions.
How does the dual-row design of the TSM-139-02-H-DV-P-TR improve PCB connectivity density?
The dual-row (-DV) arrangement accommodates 78 positions in two parallel rows on a 2.54mm (0.100 inch) grid, roughly doubling the contact count compared to a single-row connector of the same length, enabling high-signal-count board-to-board connectivity in a compact SMT footprint.
Which volume production environments are best suited for the TSM-139-02-H-DV-P-TR?
The tape-and-reel (-TR) packaging makes this 78-position connector ideal for high-volume automated SMT assembly lines using pick-and-place machines. Industrial control boards, server modules, and telecommunications equipment benefit from the reliable 2.54mm pitch dual-row SMT connectivity it provides.
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