TSM-139-02-G-DV-P-TR SAMTEC Connector (Other) In Stock
78-position dual-row surface-mount terminal strip with 0.100" (2.54mm) pitch, gold-plated contacts, and tape-and-reel packaging for automated SMT assembly in high-density board-to-board interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TSM-139-02-G-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-139-02-G-DV-P-TR?
- 78-position dual-row format at 0.100" (2.54mm) pitch accommodates high pin-count board-to-board signal and power routing in a compact SMT footprint
- Gold-plated (-G) contact finish provides low and stable contact resistance over 500+ mating cycles in humid or corrosive environments
- Tape-and-reel (-TR) packaging enables seamless integration into automated SMT pick-and-place lines for high-volume production efficiency
What is TSM-139-02-G-DV-P-TR used for?
TSM-139-02-G-DV-P-TR is designed for high-density board-to-board mating in server backplanes, industrial computing modules, and data acquisition systems where gold-plated contacts ensure reliable signal integrity across many insertion cycles. Its 78-position dual-row layout with 0.100" pitch supports mixed power and high-speed signal routing on a single connector, reducing overall connector count and PCB complexity. The tape-and-reel format integrates directly into SMT assembly workflows used in telecommunications and embedded computing manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-139-02-G-DV-P-TR datasheet?
TSM-139-02-G-DV-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-139-02-G-DV-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What advantage does the gold contact finish on TSM-139-02-G-DV-P-TR provide over tin-plated alternatives in a server environment?
The gold-plated (-G) contacts on TSM-139-02-G-DV-P-TR maintain contact resistance below 20 milliohms even after 500 mating cycles in humid data-center environments, whereas tin contacts can develop oxide films that increase resistance over time. This stable low-resistance characteristic is critical for high-speed differential signal pairs routed through the 78-pin connector in server backplane and storage interconnect applications.
How does the 78-position dual-row configuration of TSM-139-02-G-DV-P-TR compare to two separate 39-pin single-row connectors?
TSM-139-02-G-DV-P-TR's dual-row layout fits 78 positions into roughly half the PCB board-edge length compared to two separate 39-pin single-row connectors arranged end-to-end. The consolidated footprint reduces routing complexity and the risk of mismate, since a single polarized connector replaces two separate ones that could be swapped or offset during assembly.
Can TSM-139-02-G-DV-P-TR be assembled using standard SMT reflow processes, and what temperature does it withstand?
Yes, TSM-139-02-G-DV-P-TR is designed for SMT reflow soldering and is rated to withstand peak reflow temperatures of 260°C in accordance with JEDEC J-STD-020 moisture sensitivity requirements. The tape-and-reel format enables high-speed placement at rates exceeding 10,000 components per hour on standard pick-and-place equipment, supporting lean manufacturing in high-volume production environments.
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